Billep, D., Mehner, J., Shaporin, A., Vogel, K., Wuensch, D., & Wiemer, M. Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers. Gruppo Italiano Frattura.
Chicago Style (17th ed.) CitationBillep, Detlef, Jan Mehner, Alexey Shaporin, Klaus Vogel, Dirk Wuensch, and Maik Wiemer. Crack Propagation in Micro-chevron-test Samples of Direct Bonded Silicon-silicon Wafers. Gruppo Italiano Frattura.
MLA (9th ed.) CitationBillep, Detlef, et al. Crack Propagation in Micro-chevron-test Samples of Direct Bonded Silicon-silicon Wafers. Gruppo Italiano Frattura.
Warning: These citations may not always be 100% accurate.