A X-Band Integrated Passive Device Structure Based on TMV-Embedded FOWLP

A X-Band Integrated Passive Device Structure Based on TMV-Embedded FOWLP

In this paper, the fabrication and testing of an integrated passive device (IPD) structure for X-band FMCW radar based on the fan-out wafer-level packaging (FOWLP) process are discussed. First, a transition line structure is added to the IPD structure to increase the upper impedance limit of the sub...

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Bibliographic Details
Main Authors: Jiajie Yang, Lixin Xu, Xiangyu Yin, Ke Yang
Format: Article
Language:English
Published: MDPI AG 2025-06-01
Series:Micromachines
Subjects:
integrated passive device
fan-out wafer-level package
through-mold via
antenna-in-package (AiP)
ultra-thin
Online Access:https://www.mdpi.com/2072-666X/16/6/719
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