A X-Band Integrated Passive Device Structure Based on TMV-Embedded FOWLP
In this paper, the fabrication and testing of an integrated passive device (IPD) structure for X-band FMCW radar based on the fan-out wafer-level packaging (FOWLP) process are discussed. First, a transition line structure is added to the IPD structure to increase the upper impedance limit of the sub...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-06-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/16/6/719 |
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