A Method for Grading Failure Rates Within the Dynamic Effective Space of Integrated Circuits After Testing

Integrated circuits that pass testing still have quality differences, thus making grading necessary. Traditional grading methods rely on static testing and electrical measurements, which are challenging to achieve precise grading, time-consuming, and costly. A new grading method based on the failure...

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Main Authors: Wenfa Zhan, Yangxinzi Zhou, Jiangyun Zheng, Xueyuan Cai, Qingping Zhang, Xiaoqing Wen
Format: Article
Language:English
Published: MDPI AG 2025-02-01
Series:Applied Sciences
Subjects:
Online Access:https://www.mdpi.com/2076-3417/15/4/2009
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author Wenfa Zhan
Yangxinzi Zhou
Jiangyun Zheng
Xueyuan Cai
Qingping Zhang
Xiaoqing Wen
author_facet Wenfa Zhan
Yangxinzi Zhou
Jiangyun Zheng
Xueyuan Cai
Qingping Zhang
Xiaoqing Wen
author_sort Wenfa Zhan
collection DOAJ
description Integrated circuits that pass testing still have quality differences, thus making grading necessary. Traditional grading methods rely on static testing and electrical measurements, which are challenging to achieve precise grading, time-consuming, and costly. A new grading method based on the failure rate within a dynamically effective space is proposed. This method dynamically adjusts the evaluation space and uses an exponential decay function to calculate the influence weight of each neighboring chip on the evaluated chip, thereby computing the weighted failure rate of the evaluated chip and quantitatively grading the chips after wafer testing based on the scores. Experiments show that this method not only accurately captures quality differences and ensures grading accuracy but also significantly improves grading efficiency.
format Article
id doaj-art-3813a4aa95a44e159d4e26e0ae6d2002
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issn 2076-3417
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publishDate 2025-02-01
publisher MDPI AG
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series Applied Sciences
spelling doaj-art-3813a4aa95a44e159d4e26e0ae6d20022025-08-20T02:44:33ZengMDPI AGApplied Sciences2076-34172025-02-01154200910.3390/app15042009A Method for Grading Failure Rates Within the Dynamic Effective Space of Integrated Circuits After TestingWenfa Zhan0Yangxinzi Zhou1Jiangyun Zheng2Xueyuan Cai3Qingping Zhang4Xiaoqing Wen5School of Electronic Engineering & Intelligent Manufacturing, Anqing Normal University, Anqing 246133, ChinaSchool of Electronic Engineering & Intelligent Manufacturing, Anqing Normal University, Anqing 246133, ChinaSchool of Electronic Engineering & Intelligent Manufacturing, Anqing Normal University, Anqing 246133, ChinaSchool of Electronic Engineering & Intelligent Manufacturing, Anqing Normal University, Anqing 246133, ChinaSchool of Electronic Engineering & Intelligent Manufacturing, Anqing Normal University, Anqing 246133, ChinaGraduate School of Computer Science and Systems Engineering, Kyushu Institute of Technology, Iizuka-shi 820-8502, JapanIntegrated circuits that pass testing still have quality differences, thus making grading necessary. Traditional grading methods rely on static testing and electrical measurements, which are challenging to achieve precise grading, time-consuming, and costly. A new grading method based on the failure rate within a dynamically effective space is proposed. This method dynamically adjusts the evaluation space and uses an exponential decay function to calculate the influence weight of each neighboring chip on the evaluated chip, thereby computing the weighted failure rate of the evaluated chip and quantitatively grading the chips after wafer testing based on the scores. Experiments show that this method not only accurately captures quality differences and ensures grading accuracy but also significantly improves grading efficiency.https://www.mdpi.com/2076-3417/15/4/2009chip gradingdynamic adjustmentexponential decay functioneffective in-spacesemiconductor testing
spellingShingle Wenfa Zhan
Yangxinzi Zhou
Jiangyun Zheng
Xueyuan Cai
Qingping Zhang
Xiaoqing Wen
A Method for Grading Failure Rates Within the Dynamic Effective Space of Integrated Circuits After Testing
Applied Sciences
chip grading
dynamic adjustment
exponential decay function
effective in-space
semiconductor testing
title A Method for Grading Failure Rates Within the Dynamic Effective Space of Integrated Circuits After Testing
title_full A Method for Grading Failure Rates Within the Dynamic Effective Space of Integrated Circuits After Testing
title_fullStr A Method for Grading Failure Rates Within the Dynamic Effective Space of Integrated Circuits After Testing
title_full_unstemmed A Method for Grading Failure Rates Within the Dynamic Effective Space of Integrated Circuits After Testing
title_short A Method for Grading Failure Rates Within the Dynamic Effective Space of Integrated Circuits After Testing
title_sort method for grading failure rates within the dynamic effective space of integrated circuits after testing
topic chip grading
dynamic adjustment
exponential decay function
effective in-space
semiconductor testing
url https://www.mdpi.com/2076-3417/15/4/2009
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