Enhanced thermal management in microelectronic cooling: A study on pairing multiple pin-fin shapes in microchannel heat sinks
In the last decade, microelectronics have advanced significantly, resulting in higher generated heat flux, which, if not managed carefully, may lead to damage or even failure. Pin-fin microchannels are one of the promising techniques that can be used to enhance heat dissipation. This study investiga...
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Elsevier
2025-07-01
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| Series: | International Journal of Thermofluids |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666202725002307 |
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| author | Kaouthar Madi Ahmed Raafat Saeed Al Nuaimi |
| author_facet | Kaouthar Madi Ahmed Raafat Saeed Al Nuaimi |
| author_sort | Kaouthar Madi |
| collection | DOAJ |
| description | In the last decade, microelectronics have advanced significantly, resulting in higher generated heat flux, which, if not managed carefully, may lead to damage or even failure. Pin-fin microchannels are one of the promising techniques that can be used to enhance heat dissipation. This study investigates the thermal and hydrodynamic performance of microchannel heat sinks incorporating different pin fin shapes: square (S), circle (C), and triangle (T). Additionally, various combinations of these shapes, including triangle–square (T–S), triangle–circle (T–C), and triangle–circle–square (T–C–S), were explored to study the effect of combining different shapes on performance metrics. Numerical simulations, validated against experimental data, were conducted under laminar flow conditions for Reynolds numbers ranging from 250 to 1500. The results showed that circular pin fins exhibited a pressure drop 8%–90% lower than other configurations, while square pin fins demonstrated the highest temperature drop along the channel, indicating good thermodynamic performance but at the cost of 90.9% higher power consumption. Triangular pins balanced the thermodynamic and hydraulic performance, with a Nusselt number of 12.6 and a pressure drop 14.4% higher than circular pin fins. Some hybrid configurations combined the advantages of single pin shapes: the T–S arrangement achieved the highest Nusselt number (12.9) with 48.4% lower pressure drop than square pins, while the T–C hybrid maintained a pressure drop close to the circular pin case (8% deviation) while providing high overall efficiency (second best among all configurations). The findings demonstrate that while certain pin shapes perform well individually, hybrid configurations can further enhance the overall performance of microchannel heat sinks. |
| format | Article |
| id | doaj-art-36b72a150f094a2ab1b1870a917527f5 |
| institution | Kabale University |
| issn | 2666-2027 |
| language | English |
| publishDate | 2025-07-01 |
| publisher | Elsevier |
| record_format | Article |
| series | International Journal of Thermofluids |
| spelling | doaj-art-36b72a150f094a2ab1b1870a917527f52025-08-20T03:32:46ZengElsevierInternational Journal of Thermofluids2666-20272025-07-012810128310.1016/j.ijft.2025.101283Enhanced thermal management in microelectronic cooling: A study on pairing multiple pin-fin shapes in microchannel heat sinksKaouthar Madi0Ahmed Raafat1Saeed Al Nuaimi2Mechanical & Aerospace Engineering, United Arab Emirates University, 00000, Al Ain, United Arab EmiratesMechanical & Aerospace Engineering, United Arab Emirates University, 00000, Al Ain, United Arab EmiratesCorresponding author.; Mechanical & Aerospace Engineering, United Arab Emirates University, 00000, Al Ain, United Arab EmiratesIn the last decade, microelectronics have advanced significantly, resulting in higher generated heat flux, which, if not managed carefully, may lead to damage or even failure. Pin-fin microchannels are one of the promising techniques that can be used to enhance heat dissipation. This study investigates the thermal and hydrodynamic performance of microchannel heat sinks incorporating different pin fin shapes: square (S), circle (C), and triangle (T). Additionally, various combinations of these shapes, including triangle–square (T–S), triangle–circle (T–C), and triangle–circle–square (T–C–S), were explored to study the effect of combining different shapes on performance metrics. Numerical simulations, validated against experimental data, were conducted under laminar flow conditions for Reynolds numbers ranging from 250 to 1500. The results showed that circular pin fins exhibited a pressure drop 8%–90% lower than other configurations, while square pin fins demonstrated the highest temperature drop along the channel, indicating good thermodynamic performance but at the cost of 90.9% higher power consumption. Triangular pins balanced the thermodynamic and hydraulic performance, with a Nusselt number of 12.6 and a pressure drop 14.4% higher than circular pin fins. Some hybrid configurations combined the advantages of single pin shapes: the T–S arrangement achieved the highest Nusselt number (12.9) with 48.4% lower pressure drop than square pins, while the T–C hybrid maintained a pressure drop close to the circular pin case (8% deviation) while providing high overall efficiency (second best among all configurations). The findings demonstrate that while certain pin shapes perform well individually, hybrid configurations can further enhance the overall performance of microchannel heat sinks.http://www.sciencedirect.com/science/article/pii/S2666202725002307MicrochannelHeat transferPin finsMicrochip cooling |
| spellingShingle | Kaouthar Madi Ahmed Raafat Saeed Al Nuaimi Enhanced thermal management in microelectronic cooling: A study on pairing multiple pin-fin shapes in microchannel heat sinks International Journal of Thermofluids Microchannel Heat transfer Pin fins Microchip cooling |
| title | Enhanced thermal management in microelectronic cooling: A study on pairing multiple pin-fin shapes in microchannel heat sinks |
| title_full | Enhanced thermal management in microelectronic cooling: A study on pairing multiple pin-fin shapes in microchannel heat sinks |
| title_fullStr | Enhanced thermal management in microelectronic cooling: A study on pairing multiple pin-fin shapes in microchannel heat sinks |
| title_full_unstemmed | Enhanced thermal management in microelectronic cooling: A study on pairing multiple pin-fin shapes in microchannel heat sinks |
| title_short | Enhanced thermal management in microelectronic cooling: A study on pairing multiple pin-fin shapes in microchannel heat sinks |
| title_sort | enhanced thermal management in microelectronic cooling a study on pairing multiple pin fin shapes in microchannel heat sinks |
| topic | Microchannel Heat transfer Pin fins Microchip cooling |
| url | http://www.sciencedirect.com/science/article/pii/S2666202725002307 |
| work_keys_str_mv | AT kaoutharmadi enhancedthermalmanagementinmicroelectroniccoolingastudyonpairingmultiplepinfinshapesinmicrochannelheatsinks AT ahmedraafat enhancedthermalmanagementinmicroelectroniccoolingastudyonpairingmultiplepinfinshapesinmicrochannelheatsinks AT saeedalnuaimi enhancedthermalmanagementinmicroelectroniccoolingastudyonpairingmultiplepinfinshapesinmicrochannelheatsinks |