Li, X., Wang, Q., Lu, L., Guan, Y., & Zhou, W. Improving bonding strength of W/Cu dual metal interface through laser micro-structuring method. Light Publishing Group.
Chicago Style (17th ed.) CitationLi, Xing, Quanjie Wang, Libing Lu, Yingchun Guan, and Wei Zhou. Improving Bonding Strength of W/Cu Dual Metal Interface Through Laser Micro-structuring Method. Light Publishing Group.
MLA (9th ed.) CitationLi, Xing, et al. Improving Bonding Strength of W/Cu Dual Metal Interface Through Laser Micro-structuring Method. Light Publishing Group.
Warning: These citations may not always be 100% accurate.