Fabrication and Electrical Characterization of Low-Temperature Polysilicon Films for Sensor Applications
The development of low-temperature piezoresistive materials provides compatibility with standard silicon-based MEMS fabrication processes. Additionally, it enables the use of such material in flexible substrates, thereby expanding the potential for various device applications. This work demonstrates...
Saved in:
| Main Authors: | Filipa C. Mota, Inês S. Garcia, Aritz Retolaza, Dimitri E. Santos, Patrícia C. Sousa, Diogo E. Aguiam, Rosana A. Dias, Carlos Calaza, Alexandre F. Silva, Filipe S. Alves |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-12-01
|
| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/16/1/57 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
The Effect of Area Density of Polysilicon Thermocouples on Thermoelectric Performance
by: Shih-Ming Yang, et al.
Published: (2025-02-01) -
Investigation of Contact Properties and Device Performance for Bifacial Double-Side Textured Silicon Solar Cells With Polysilicon Based Passivating Contacts
by: Pradeep Padhamnath, et al.
Published: (2025-01-01) -
On the Transconductance of Polysilicon Thin Film Transistors
by: Alka Panwar, et al.
Published: (2011-01-01) -
Incorporation of Resistive Random Access Memory into Low‐Temperature Polysilicon Transistor with Fin‐Like Structure as 1T1R Device
by: Wei‐Chen Huang, et al.
Published: (2020-06-01) -
Dopant Diffusion‐Induced Dielectric Breakdown: Stacked Dielectric Reliability on Heavily Doped Polysilicon
by: Shuo Wang, et al.
Published: (2025-08-01)