XunChao, L., & Ying, L. STUDY ON CHIP COMPONENT NO-FILLET SOLDER JOINT STRESS AND STRAIN UNDER THERMAL CYCLE. Editorial Office of Journal of Mechanical Strength.
Chicago Style (17th ed.) CitationXunChao, LIN, and LIANG Ying. STUDY ON CHIP COMPONENT NO-FILLET SOLDER JOINT STRESS AND STRAIN UNDER THERMAL CYCLE. Editorial Office of Journal of Mechanical Strength.
MLA (9th ed.) CitationXunChao, LIN, and LIANG Ying. STUDY ON CHIP COMPONENT NO-FILLET SOLDER JOINT STRESS AND STRAIN UNDER THERMAL CYCLE. Editorial Office of Journal of Mechanical Strength.
Warning: These citations may not always be 100% accurate.