APA (7th ed.) Citation

Park, S., Lee, S., Choi, J., & Kim, S. E. Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application. IEEE.

Chicago Style (17th ed.) Citation

Park, Sangwoo, Sangmin Lee, Junyoung Choi, and Sarah Eunkyung Kim. Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application. IEEE.

MLA (9th ed.) Citation

Park, Sangwoo, et al. Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application. IEEE.