Wei, H., ChunYue, H., & Ying, L. RESEARCH ON HEAT DISSIPATION OF LTCC SUBSTRATE MICROCHANNEL BASED ON ORTHOGONAL DESIGN. Editorial Office of Journal of Mechanical Strength.
Chicago Style (17th ed.) CitationWei, HE, HUANG ChunYue, and LIANG Ying. RESEARCH ON HEAT DISSIPATION OF LTCC SUBSTRATE MICROCHANNEL BASED ON ORTHOGONAL DESIGN. Editorial Office of Journal of Mechanical Strength.
MLA (9th ed.) CitationWei, HE, et al. RESEARCH ON HEAT DISSIPATION OF LTCC SUBSTRATE MICROCHANNEL BASED ON ORTHOGONAL DESIGN. Editorial Office of Journal of Mechanical Strength.
Warning: These citations may not always be 100% accurate.