Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling
Abstract Effective heat dissipation remains a grand challenge for energy-dense devices and systems. As heterogeneous integration becomes increasingly inevitable in electronics, thermal resistance at interfaces has emerged as a critical bottleneck for thermal management. However, existing thermal int...
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| Format: | Article |
| Language: | English |
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Nature Portfolio
2025-01-01
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| Series: | Nature Communications |
| Online Access: | https://doi.org/10.1038/s41467-025-56163-8 |
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| author | Rui Cheng Qixian Wang Zexiao Wang Lin Jing Ana V. Garcia-Caraveo Zhuo Li Yibai Zhong Xiu Liu Xiao Luo Tianyi Huang Hyeong Seok Yun Hakan Salihoglu Loren Russell Navid Kazem Tianyi Chen Sheng Shen |
| author_facet | Rui Cheng Qixian Wang Zexiao Wang Lin Jing Ana V. Garcia-Caraveo Zhuo Li Yibai Zhong Xiu Liu Xiao Luo Tianyi Huang Hyeong Seok Yun Hakan Salihoglu Loren Russell Navid Kazem Tianyi Chen Sheng Shen |
| author_sort | Rui Cheng |
| collection | DOAJ |
| description | Abstract Effective heat dissipation remains a grand challenge for energy-dense devices and systems. As heterogeneous integration becomes increasingly inevitable in electronics, thermal resistance at interfaces has emerged as a critical bottleneck for thermal management. However, existing thermal interface solutions are constrained by either high thermal resistance or poor reliability. We report a strategy to create printable, high-performance liquid-infused nanostructured composites, comprising a mechanically soft and thermally conductive double-sided Cu nanowire array scaffold infused with a customized thermal-bridge liquid that suppresses contact thermal resistance. The liquid infusion concept is versatile for a broad range of thermal interface applications. Remarkably, the liquid metal infused nanostructured composite exhibits an ultra-low thermal resistance <1 mm² K W-1 at interface, outperforming state-of-the-art thermal interface materials on chip-cooling. The high reliability of the nanostructured composites enables undegraded performance through extreme temperature cycling. We envision liquid-infused nanostructured composites as a universal thermal interface solution for cooling applications in data centers, GPU/CPU systems, solid-state lasers, and LEDs. |
| format | Article |
| id | doaj-art-2fecd5193da8477381701d554e3c280c |
| institution | Kabale University |
| issn | 2041-1723 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | Nature Portfolio |
| record_format | Article |
| series | Nature Communications |
| spelling | doaj-art-2fecd5193da8477381701d554e3c280c2025-01-19T12:32:18ZengNature PortfolioNature Communications2041-17232025-01-011611810.1038/s41467-025-56163-8Liquid-infused nanostructured composite as a high-performance thermal interface material for effective coolingRui Cheng0Qixian Wang1Zexiao Wang2Lin Jing3Ana V. Garcia-Caraveo4Zhuo Li5Yibai Zhong6Xiu Liu7Xiao Luo8Tianyi Huang9Hyeong Seok Yun10Hakan Salihoglu11Loren Russell12Navid Kazem13Tianyi Chen14Sheng Shen15Department of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes AveDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes AveDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes AveDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes AveCollege of Engineering, Oregon State University, 1791 SW Campus WayDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes AveDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes AveDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes AveDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes AveDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes AveDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes AveDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes AveArieca, Inc., 201 N Braddock Ave STE 334Arieca, Inc., 201 N Braddock Ave STE 334College of Engineering, Oregon State University, 1791 SW Campus WayDepartment of Mechanical Engineering, Carnegie Mellon University, 5000 Forbes AveAbstract Effective heat dissipation remains a grand challenge for energy-dense devices and systems. As heterogeneous integration becomes increasingly inevitable in electronics, thermal resistance at interfaces has emerged as a critical bottleneck for thermal management. However, existing thermal interface solutions are constrained by either high thermal resistance or poor reliability. We report a strategy to create printable, high-performance liquid-infused nanostructured composites, comprising a mechanically soft and thermally conductive double-sided Cu nanowire array scaffold infused with a customized thermal-bridge liquid that suppresses contact thermal resistance. The liquid infusion concept is versatile for a broad range of thermal interface applications. Remarkably, the liquid metal infused nanostructured composite exhibits an ultra-low thermal resistance <1 mm² K W-1 at interface, outperforming state-of-the-art thermal interface materials on chip-cooling. The high reliability of the nanostructured composites enables undegraded performance through extreme temperature cycling. We envision liquid-infused nanostructured composites as a universal thermal interface solution for cooling applications in data centers, GPU/CPU systems, solid-state lasers, and LEDs.https://doi.org/10.1038/s41467-025-56163-8 |
| spellingShingle | Rui Cheng Qixian Wang Zexiao Wang Lin Jing Ana V. Garcia-Caraveo Zhuo Li Yibai Zhong Xiu Liu Xiao Luo Tianyi Huang Hyeong Seok Yun Hakan Salihoglu Loren Russell Navid Kazem Tianyi Chen Sheng Shen Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling Nature Communications |
| title | Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling |
| title_full | Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling |
| title_fullStr | Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling |
| title_full_unstemmed | Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling |
| title_short | Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling |
| title_sort | liquid infused nanostructured composite as a high performance thermal interface material for effective cooling |
| url | https://doi.org/10.1038/s41467-025-56163-8 |
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