INTENSIFICATION OF HEAT TRANSFER FROM THE IC CHIP TO THE HEAT SINK THROUGH THE USE OF NANOFILM THERMOELECTRIC HEAT PUMP
The article considers the to enhance the efficiency the thermoelectric heat pump by making the branches of semiconductor p- and n-type as nanofilms and creating conditions for the emergence of additional thermoeffect between the hot and cold junctions of dissimilar metals that will create a more eff...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | Russian |
| Published: |
Dagestan State Technical University
2016-08-01
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| Series: | Вестник Дагестанского государственного технического университета: Технические науки |
| Subjects: | |
| Online Access: | https://vestnik.dgtu.ru/jour/article/view/255 |
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