Tribo-Electrochemical Considerations for Assessing Galvanic Corrosion Characteristics of Metals in Chemical Mechanical Planarization
The manufacturing of integrated circuits involves multiple steps of chemical mechanical planarization (CMP) involving different materials. Mitigating CMP-induced defects is a main requirement of all CMP schemes. In this context, controlling galvanic corrosion is a particularly challenging task for p...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-04-01
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| Series: | Electrochem |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2673-3293/6/2/15 |
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