Effective preparation of low-melting solder materials for atom probe tomography
Abstract Low-melting metal alloys have gained renewed attention for additive manufacturing, energy storage and microelectronics. However, micro- and nanostructure characterisation demands highly sophisticated sample preparation. Here, we optimise the Ga-FIB preparation of atom probe tomography (APT)...
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| Format: | Article |
| Language: | English |
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Nature Portfolio
2024-11-01
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| Series: | Scientific Reports |
| Online Access: | https://doi.org/10.1038/s41598-024-79753-w |
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| _version_ | 1850064498979766272 |
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| author | Charlotte Cui Michael Tkadletz Michael Reisinger Peter Imrich Walter Hartner Roland Brunner |
| author_facet | Charlotte Cui Michael Tkadletz Michael Reisinger Peter Imrich Walter Hartner Roland Brunner |
| author_sort | Charlotte Cui |
| collection | DOAJ |
| description | Abstract Low-melting metal alloys have gained renewed attention for additive manufacturing, energy storage and microelectronics. However, micro- and nanostructure characterisation demands highly sophisticated sample preparation. Here, we optimise the Ga-FIB preparation of atom probe tomography (APT) specimens for low melting SAC305 solder materials utilising different FESEM/FIB stage temperatures. We study the effects of FESEM/FIB stage temperature on the specimen milling behaviour during Ga-FIB preparation and compare the extent of Ga implantation and precipitate coarsening during the preparation utilising energy dispersive X-ray spectroscopy and APT. We show that cooling the sample to −60 °C during FIB milling utilising a Peltier cooling stage improves the behaviour of the specimen during the final low-keV milling step significantly. We conclude that performing all Ga-FIB-sample interactions at −60 °C with a Pt-protection layer allows for effective and reproducible APT specimen preparation for low-melting alloys, such as SAC305. |
| format | Article |
| id | doaj-art-2b7cac0d20b2404185ef3ca9f438de4b |
| institution | DOAJ |
| issn | 2045-2322 |
| language | English |
| publishDate | 2024-11-01 |
| publisher | Nature Portfolio |
| record_format | Article |
| series | Scientific Reports |
| spelling | doaj-art-2b7cac0d20b2404185ef3ca9f438de4b2025-08-20T02:49:17ZengNature PortfolioScientific Reports2045-23222024-11-0114111110.1038/s41598-024-79753-wEffective preparation of low-melting solder materials for atom probe tomographyCharlotte Cui0Michael Tkadletz1Michael Reisinger2Peter Imrich3Walter Hartner4Roland Brunner5Materials Center Leoben Forschung GmbHMontanuniversität Leoben, Chair of Functional Materials at the Department Materials ScienceKompetenzzentrum für Automobil- und Industrieelektronik GmbHKompetenzzentrum für Automobil- und Industrieelektronik GmbHInfineon Technologies AGMaterials Center Leoben Forschung GmbHAbstract Low-melting metal alloys have gained renewed attention for additive manufacturing, energy storage and microelectronics. However, micro- and nanostructure characterisation demands highly sophisticated sample preparation. Here, we optimise the Ga-FIB preparation of atom probe tomography (APT) specimens for low melting SAC305 solder materials utilising different FESEM/FIB stage temperatures. We study the effects of FESEM/FIB stage temperature on the specimen milling behaviour during Ga-FIB preparation and compare the extent of Ga implantation and precipitate coarsening during the preparation utilising energy dispersive X-ray spectroscopy and APT. We show that cooling the sample to −60 °C during FIB milling utilising a Peltier cooling stage improves the behaviour of the specimen during the final low-keV milling step significantly. We conclude that performing all Ga-FIB-sample interactions at −60 °C with a Pt-protection layer allows for effective and reproducible APT specimen preparation for low-melting alloys, such as SAC305.https://doi.org/10.1038/s41598-024-79753-w |
| spellingShingle | Charlotte Cui Michael Tkadletz Michael Reisinger Peter Imrich Walter Hartner Roland Brunner Effective preparation of low-melting solder materials for atom probe tomography Scientific Reports |
| title | Effective preparation of low-melting solder materials for atom probe tomography |
| title_full | Effective preparation of low-melting solder materials for atom probe tomography |
| title_fullStr | Effective preparation of low-melting solder materials for atom probe tomography |
| title_full_unstemmed | Effective preparation of low-melting solder materials for atom probe tomography |
| title_short | Effective preparation of low-melting solder materials for atom probe tomography |
| title_sort | effective preparation of low melting solder materials for atom probe tomography |
| url | https://doi.org/10.1038/s41598-024-79753-w |
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