Scaling Logic Area With Multitier Standard Cells
While the footprint of digital complementary metal-oxide–semiconductor (CMOS) circuits has continued to decrease over the years, physical limitations for further intralayer geometric scaling become apparent. To further increase the logic density, the international roadmap for devices and...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2024-01-01
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| Series: | IEEE Journal on Exploratory Solid-State Computational Devices and Circuits |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10720813/ |
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