Manufacture of an ether-modified copolyester fiber with high physical performances and its applying feasibility for copper clad laminate (CCL) substrate of fifth generation long-term evolution (5 G LTE)
Although L-Glass is a competent reinforced fiber for the copper clad laminate (CCL) substrate of fifth generation long-term evolution (5 G LTE), its high-cost and intricate manufacturing procedure consumes much energy and time, leading to high carbon emission. To solve this issue, an ether-modified...
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Elsevier
2025-07-01
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| author | Yun-Ping Chang Syang-Peng Rwei Meng-Hsin Chen Lung-Chang Liu |
| author_facet | Yun-Ping Chang Syang-Peng Rwei Meng-Hsin Chen Lung-Chang Liu |
| author_sort | Yun-Ping Chang |
| collection | DOAJ |
| description | Although L-Glass is a competent reinforced fiber for the copper clad laminate (CCL) substrate of fifth generation long-term evolution (5 G LTE), its high-cost and intricate manufacturing procedure consumes much energy and time, leading to high carbon emission. To solve this issue, an ether-modified copolyester fiber with high tensile strength of 1863 MPa, excellent elastic modulus of 54 GPa, low density of 1.4 g/cm3, moderate coefficient of thermal expansion (CTE) of 5.1 ppm/°C, and good thermal conductivity of 1.63 W/m*K has been firstly prepared by the proper formula, melt-spinning apparatus, and thermal treatment. With lab-made melt-spinning copolyester fiber, low-dielectric-property epoxy resin, and the copper foil, moreover, we have also fabricated the CCL substrate prototype of 5 G LTE by the dry-laid process, impregnation, and hot compression, evaluating the feasibility because its Dk (10/28 GHz), Df (10/28 GHz), peel strength to copper foil, and CTE can reach 3.04/3.02, 0.0031/0.0041, 84.6 N/cm, and 25.6 ppm/°C, respectively. Experimental results indicate that lab-made melt-spinning copolyester fiber is a promising reinforced fiber for CCL substrate of 5 G LTE.title-text |
| format | Article |
| id | doaj-art-2ac4e945616d4d2d92c68e64968be479 |
| institution | DOAJ |
| issn | 2949-8228 |
| language | English |
| publishDate | 2025-07-01 |
| publisher | Elsevier |
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| series | Next Materials |
| spelling | doaj-art-2ac4e945616d4d2d92c68e64968be4792025-08-20T03:19:54ZengElsevierNext Materials2949-82282025-07-01810078210.1016/j.nxmate.2025.100782Manufacture of an ether-modified copolyester fiber with high physical performances and its applying feasibility for copper clad laminate (CCL) substrate of fifth generation long-term evolution (5 G LTE)Yun-Ping Chang0Syang-Peng Rwei1Meng-Hsin Chen2Lung-Chang Liu3Department of Molecular Science and Engineering, National Taipei University of Technology, Taipei 10608, TaiwanDepartment of Molecular Science and Engineering, National Taipei University of Technology, Taipei 10608, Taiwan; Corresponding author.Material and Chemical Research Laboratories, Industrial Technology Research Institute, Hsinchu 30011, TaiwanMaterial and Chemical Research Laboratories, Industrial Technology Research Institute, Hsinchu 30011, TaiwanAlthough L-Glass is a competent reinforced fiber for the copper clad laminate (CCL) substrate of fifth generation long-term evolution (5 G LTE), its high-cost and intricate manufacturing procedure consumes much energy and time, leading to high carbon emission. To solve this issue, an ether-modified copolyester fiber with high tensile strength of 1863 MPa, excellent elastic modulus of 54 GPa, low density of 1.4 g/cm3, moderate coefficient of thermal expansion (CTE) of 5.1 ppm/°C, and good thermal conductivity of 1.63 W/m*K has been firstly prepared by the proper formula, melt-spinning apparatus, and thermal treatment. With lab-made melt-spinning copolyester fiber, low-dielectric-property epoxy resin, and the copper foil, moreover, we have also fabricated the CCL substrate prototype of 5 G LTE by the dry-laid process, impregnation, and hot compression, evaluating the feasibility because its Dk (10/28 GHz), Df (10/28 GHz), peel strength to copper foil, and CTE can reach 3.04/3.02, 0.0031/0.0041, 84.6 N/cm, and 25.6 ppm/°C, respectively. Experimental results indicate that lab-made melt-spinning copolyester fiber is a promising reinforced fiber for CCL substrate of 5 G LTE.title-texthttp://www.sciencedirect.com/science/article/pii/S2949822825003004CopolyesterMelt-spinningMechanical propertyDielectric property |
| spellingShingle | Yun-Ping Chang Syang-Peng Rwei Meng-Hsin Chen Lung-Chang Liu Manufacture of an ether-modified copolyester fiber with high physical performances and its applying feasibility for copper clad laminate (CCL) substrate of fifth generation long-term evolution (5 G LTE) Next Materials Copolyester Melt-spinning Mechanical property Dielectric property |
| title | Manufacture of an ether-modified copolyester fiber with high physical performances and its applying feasibility for copper clad laminate (CCL) substrate of fifth generation long-term evolution (5 G LTE) |
| title_full | Manufacture of an ether-modified copolyester fiber with high physical performances and its applying feasibility for copper clad laminate (CCL) substrate of fifth generation long-term evolution (5 G LTE) |
| title_fullStr | Manufacture of an ether-modified copolyester fiber with high physical performances and its applying feasibility for copper clad laminate (CCL) substrate of fifth generation long-term evolution (5 G LTE) |
| title_full_unstemmed | Manufacture of an ether-modified copolyester fiber with high physical performances and its applying feasibility for copper clad laminate (CCL) substrate of fifth generation long-term evolution (5 G LTE) |
| title_short | Manufacture of an ether-modified copolyester fiber with high physical performances and its applying feasibility for copper clad laminate (CCL) substrate of fifth generation long-term evolution (5 G LTE) |
| title_sort | manufacture of an ether modified copolyester fiber with high physical performances and its applying feasibility for copper clad laminate ccl substrate of fifth generation long term evolution 5 g lte |
| topic | Copolyester Melt-spinning Mechanical property Dielectric property |
| url | http://www.sciencedirect.com/science/article/pii/S2949822825003004 |
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