Broadband Millimeter-Wave Front-End Module Design Considerations in FD-SOI CMOS vs. GaN HEMTs
Millimeter-wave (mm-Wave) phased array systems need to meet the transmitter (Tx) equivalent isotropic radiated power (EIRP) requirement, and that depends mainly on the design of two key sub-components: (1) the antenna array and (2) the Tx power amplifier (PA) in the front-end-modules (FEMs). Simulat...
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2024-12-01
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| author | Clint Sweeney Donald Y. C. Lie Jill C. Mayeda Jerry Lopez |
| author_facet | Clint Sweeney Donald Y. C. Lie Jill C. Mayeda Jerry Lopez |
| author_sort | Clint Sweeney |
| collection | DOAJ |
| description | Millimeter-wave (mm-Wave) phased array systems need to meet the transmitter (Tx) equivalent isotropic radiated power (EIRP) requirement, and that depends mainly on the design of two key sub-components: (1) the antenna array and (2) the Tx power amplifier (PA) in the front-end-modules (FEMs). Simulations using an electromagnetic (EM) solver carried out in Cadence AWR with AXIEM suggest that for two uniform square patch antenna arrays at 24 GHz, the 4 element array has ~6 dB lower antenna gain and twice the half power beam width (HPBW) compared to the 16 element array. We also present measurements and post-layout parasitic-extracted (PEX) EM simulation data taken on two broadband mm-Wave PAs designed in our lab that cover the key portions of the fifth-generation (5G) FR2-band (i.e., 24.25–52.6 GHz) that lies between the super-high-frequency (SHF, i.e., 3–30 GHz) band and the extremely-high-frequency (EHF, i.e., 30–300 GHz) band: one designed in a 22 nm fully depleted silicon on insulator (FD-SOI) CMOS process, and the other in an advanced 40 nm Gallium Nitride (GaN) high-electron-mobility transistor (HEMT) process. The FD-SOI PA achieves saturated output power (<i>P<sub>OUT,SAT</sub></i>) of ~14 dBm and peak power-added efficiency (PAE) of ~20% with ~14 dB of gain and 3 dB bandwidth (BW) from ~19.1 to 46.5 GHz in measurement, while the GaN PA achieves measured <i>P<sub>OUT,SAT</sub></i> of ~24 dBm and peak PAE of ~20% with ~20 dB gain and 3 dB BW from ~19.9 to 35.2 GHz. The PAs’ measured data are in good agreement with the PEX EM simulated data, and 3rd Watt-level GaN PA design data are also presented, but with simulated PEX EM data only. Assuming each antenna element will be driven by one FEM and each phased array targets the same 65 dBm EIRP, millimeter wave (mm-Wave) antenna arrays using the Watt-level GaN PAs and FEMs are expected to achieve roughly 2× wider HPBW with 4× reduction in the array size compared with the arrays using Si FEMs, which shall alleviate the thorny mm-Wave line-of-sight (LOS)-blocking problems significantly. |
| format | Article |
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| spelling | doaj-art-2a2efce5012a414495ad1195bcd991962025-08-20T01:55:26ZengMDPI AGApplied Sciences2076-34172024-12-0114231142910.3390/app142311429Broadband Millimeter-Wave Front-End Module Design Considerations in FD-SOI CMOS vs. GaN HEMTsClint Sweeney0Donald Y. C. Lie1Jill C. Mayeda2Jerry Lopez3Department of Electrical and Computer Engineering, Texas Tech University, Lubbock, TX 79409, USADepartment of Electrical and Computer Engineering, Texas Tech University, Lubbock, TX 79409, USADepartment of Electrical and Computer Engineering, Texas Tech University, Lubbock, TX 79409, USADepartment of Electrical and Computer Engineering, Texas Tech University, Lubbock, TX 79409, USAMillimeter-wave (mm-Wave) phased array systems need to meet the transmitter (Tx) equivalent isotropic radiated power (EIRP) requirement, and that depends mainly on the design of two key sub-components: (1) the antenna array and (2) the Tx power amplifier (PA) in the front-end-modules (FEMs). Simulations using an electromagnetic (EM) solver carried out in Cadence AWR with AXIEM suggest that for two uniform square patch antenna arrays at 24 GHz, the 4 element array has ~6 dB lower antenna gain and twice the half power beam width (HPBW) compared to the 16 element array. We also present measurements and post-layout parasitic-extracted (PEX) EM simulation data taken on two broadband mm-Wave PAs designed in our lab that cover the key portions of the fifth-generation (5G) FR2-band (i.e., 24.25–52.6 GHz) that lies between the super-high-frequency (SHF, i.e., 3–30 GHz) band and the extremely-high-frequency (EHF, i.e., 30–300 GHz) band: one designed in a 22 nm fully depleted silicon on insulator (FD-SOI) CMOS process, and the other in an advanced 40 nm Gallium Nitride (GaN) high-electron-mobility transistor (HEMT) process. The FD-SOI PA achieves saturated output power (<i>P<sub>OUT,SAT</sub></i>) of ~14 dBm and peak power-added efficiency (PAE) of ~20% with ~14 dB of gain and 3 dB bandwidth (BW) from ~19.1 to 46.5 GHz in measurement, while the GaN PA achieves measured <i>P<sub>OUT,SAT</sub></i> of ~24 dBm and peak PAE of ~20% with ~20 dB gain and 3 dB BW from ~19.9 to 35.2 GHz. The PAs’ measured data are in good agreement with the PEX EM simulated data, and 3rd Watt-level GaN PA design data are also presented, but with simulated PEX EM data only. Assuming each antenna element will be driven by one FEM and each phased array targets the same 65 dBm EIRP, millimeter wave (mm-Wave) antenna arrays using the Watt-level GaN PAs and FEMs are expected to achieve roughly 2× wider HPBW with 4× reduction in the array size compared with the arrays using Si FEMs, which shall alleviate the thorny mm-Wave line-of-sight (LOS)-blocking problems significantly.https://www.mdpi.com/2076-3417/14/23/11429fifth generation (5G)6Gfront-end module (FEM)high-electron-mobility-transistor (HEMT)half power beam width (HPBW)millimeter wave (mm-Wave) |
| spellingShingle | Clint Sweeney Donald Y. C. Lie Jill C. Mayeda Jerry Lopez Broadband Millimeter-Wave Front-End Module Design Considerations in FD-SOI CMOS vs. GaN HEMTs Applied Sciences fifth generation (5G) 6G front-end module (FEM) high-electron-mobility-transistor (HEMT) half power beam width (HPBW) millimeter wave (mm-Wave) |
| title | Broadband Millimeter-Wave Front-End Module Design Considerations in FD-SOI CMOS vs. GaN HEMTs |
| title_full | Broadband Millimeter-Wave Front-End Module Design Considerations in FD-SOI CMOS vs. GaN HEMTs |
| title_fullStr | Broadband Millimeter-Wave Front-End Module Design Considerations in FD-SOI CMOS vs. GaN HEMTs |
| title_full_unstemmed | Broadband Millimeter-Wave Front-End Module Design Considerations in FD-SOI CMOS vs. GaN HEMTs |
| title_short | Broadband Millimeter-Wave Front-End Module Design Considerations in FD-SOI CMOS vs. GaN HEMTs |
| title_sort | broadband millimeter wave front end module design considerations in fd soi cmos vs gan hemts |
| topic | fifth generation (5G) 6G front-end module (FEM) high-electron-mobility-transistor (HEMT) half power beam width (HPBW) millimeter wave (mm-Wave) |
| url | https://www.mdpi.com/2076-3417/14/23/11429 |
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