Effects of surface state for Mo–Cu interlayer materials on interface bonding of multi-layer Cu/MoCu/Cu composites
Mo–30Cu alloy billets were prepared by powder metallurgy infiltration method, the rolled Mo–30Cu billets and oxygen-free copper plates were hot-pressed at 970 ℃ with a pressure of 30 MPa to obtain 5-layer Cu/MoCu/Cu (CPC) composites. The effects of the Mo–30Cu surface treatments on the interface bon...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Powder Metallurgy Technology
2023-06-01
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| Series: | Fenmo yejin jishu |
| Subjects: | |
| Online Access: | https://pmt.ustb.edu.cn/article/doi/10.19591/j.cnki.cn11-1974/tf.2023040007 |
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