Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling
In this paper, two intelligent methods which are GAs and PSO are used to model noise coupling in a Three-Dimensional Integrated Circuit (3D-IC) based on TSVs. These techniques are rarely used in this type of structure. They allow computing all the elements of the noise model, which helps to estimate...
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| Format: | Article |
| Language: | English |
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Wiley
2021-01-01
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| Series: | Applied Computational Intelligence and Soft Computing |
| Online Access: | http://dx.doi.org/10.1155/2021/8830395 |
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| author | Khaoula Ait Belaid H. Belahrach H. Ayad |
| author_facet | Khaoula Ait Belaid H. Belahrach H. Ayad |
| author_sort | Khaoula Ait Belaid |
| collection | DOAJ |
| description | In this paper, two intelligent methods which are GAs and PSO are used to model noise coupling in a Three-Dimensional Integrated Circuit (3D-IC) based on TSVs. These techniques are rarely used in this type of structure. They allow computing all the elements of the noise model, which helps to estimate the noise transfer function in the frequency and time domain in 3D complicated systems. Noise models include TSVs, active circuits, and substrate, which make them difficult to model and to estimate. Indeed, the proposed approaches based on GA and PSO are robust and powerful. To validate the method, comparisons among the results found by GA, PSO, measurements, and the 3D-TLM method, which presents an analytical technique, are made. According to the obtained simulation and experimental results, it is found that the proposed methods are valid, efficient, precise, and robust. |
| format | Article |
| id | doaj-art-29bee56bbcd2461695d04d3db69f2edb |
| institution | Kabale University |
| issn | 1687-9724 1687-9732 |
| language | English |
| publishDate | 2021-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Applied Computational Intelligence and Soft Computing |
| spelling | doaj-art-29bee56bbcd2461695d04d3db69f2edb2025-08-20T03:54:37ZengWileyApplied Computational Intelligence and Soft Computing1687-97241687-97322021-01-01202110.1155/2021/88303958830395Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise CouplingKhaoula Ait Belaid0H. Belahrach1H. Ayad2Laboratory of Electrical Systems and Telecommunications, Department of Physics, Faculty of Sciences and Technology, Cadi Ayyad University, Marrakesh, MoroccoLaboratory of Electrical Systems and Telecommunications, Department of Physics, Faculty of Sciences and Technology, Cadi Ayyad University, Marrakesh, MoroccoLaboratory of Electrical Systems and Telecommunications, Department of Physics, Faculty of Sciences and Technology, Cadi Ayyad University, Marrakesh, MoroccoIn this paper, two intelligent methods which are GAs and PSO are used to model noise coupling in a Three-Dimensional Integrated Circuit (3D-IC) based on TSVs. These techniques are rarely used in this type of structure. They allow computing all the elements of the noise model, which helps to estimate the noise transfer function in the frequency and time domain in 3D complicated systems. Noise models include TSVs, active circuits, and substrate, which make them difficult to model and to estimate. Indeed, the proposed approaches based on GA and PSO are robust and powerful. To validate the method, comparisons among the results found by GA, PSO, measurements, and the 3D-TLM method, which presents an analytical technique, are made. According to the obtained simulation and experimental results, it is found that the proposed methods are valid, efficient, precise, and robust.http://dx.doi.org/10.1155/2021/8830395 |
| spellingShingle | Khaoula Ait Belaid H. Belahrach H. Ayad Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling Applied Computational Intelligence and Soft Computing |
| title | Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling |
| title_full | Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling |
| title_fullStr | Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling |
| title_full_unstemmed | Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling |
| title_short | Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling |
| title_sort | genetic algorithms and particle swarm optimization mechanisms for through silicon via tsv noise coupling |
| url | http://dx.doi.org/10.1155/2021/8830395 |
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