Stress Response of Aspergillus niger Spores to Copper Surfaces and the Implications for Antifungal Surface Functionalization

Stress Response of Aspergillus niger Spores to Copper Surfaces and the Implications for Antifungal Surface Functionalization

Abstract Fungal contaminations pose a persistent challenge in the fields of healthcare, agriculture, and industry, primarily due to their environmental adaptability and increasing resistance to antifungal agents. In this study Aspergillus niger is utilized as model organism. This work evaluates copp...

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Main Authors: Stella Marie Timofeev, Katharina Siems, Daniel Wyn Müller, Aisha Saddiqa Ahmed, Alessa Schiele, Kristina Brix, Carolin Luisa Krämer, Franca Arndt, Ralf Kautenburger, Frank Mücklich, Stefan Leuko
Format: Article
Language:English
Published: Wiley-VCH 2025-05-01
Series:Advanced Materials Interfaces
Subjects:
antifungal surfaces
copper
functionalized surfaces
spore resilience stress
Online Access:https://doi.org/10.1002/admi.202400852
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