High-performance W–Cu composites preparation technology, modulation strategy and strengthening mechanism
W–Cu composites are widely used as electrode materials, electronic packaging materials, heat sinks, and targets in the defense industry, aerospace, and electronic information fields due to their good conductivity, high melting point, good mechanical properties, and good anti-arc erosion performance....
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| Main Authors: | Weiyang Long, Yifan Yan, Mingzhu You, Haoran Wu, Zheng Wei, Hongfei Zhang, Shaodan Yang, Zhiyuan Zhu, Kexing Song |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425008610 |
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