High-performance W–Cu composites preparation technology, modulation strategy and strengthening mechanism

W–Cu composites are widely used as electrode materials, electronic packaging materials, heat sinks, and targets in the defense industry, aerospace, and electronic information fields due to their good conductivity, high melting point, good mechanical properties, and good anti-arc erosion performance....

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Main Authors: Weiyang Long, Yifan Yan, Mingzhu You, Haoran Wu, Zheng Wei, Hongfei Zhang, Shaodan Yang, Zhiyuan Zhu, Kexing Song
Format: Article
Language:English
Published: Elsevier 2025-05-01
Series:Journal of Materials Research and Technology
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Online Access:http://www.sciencedirect.com/science/article/pii/S2238785425008610
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author Weiyang Long
Yifan Yan
Mingzhu You
Haoran Wu
Zheng Wei
Hongfei Zhang
Shaodan Yang
Zhiyuan Zhu
Kexing Song
author_facet Weiyang Long
Yifan Yan
Mingzhu You
Haoran Wu
Zheng Wei
Hongfei Zhang
Shaodan Yang
Zhiyuan Zhu
Kexing Song
author_sort Weiyang Long
collection DOAJ
description W–Cu composites are widely used as electrode materials, electronic packaging materials, heat sinks, and targets in the defense industry, aerospace, and electronic information fields due to their good conductivity, high melting point, good mechanical properties, and good anti-arc erosion performance. In recent years, high-performance W alloys have gradually become the key materials in the defense industry and cutting-edge technologies, and new processing technologies have greatly improved the material density, uniformity of microstructure, mechanical properties, and physical properties of W alloys, but have also raised higher requirements for the high reliability, zero accidents, and long service life of defense and military materials. By optimizing the composite design and fabrication process, controlling the growth of microstructure and interfacial diffusion, and improving the fine grain distribution and uniformity, the densification, mechanical properties, and anti-arc erosion performance of W–Cu composites can be further improved. This paper reviews the evolution of preparation technology and modulation strategy for W–Cu composite, discusses the relationship between microstructure growth and mechanical properties of W–Cu composites, and systematically summarizes the influence mechanisms of alloy element content, existence form and microstructure on the electrical and thermal conductivity, strength, and erosion resistance of W–Cu composites. Finally, the future development trends and application prospects of W–Cu composites, including ultra-high voltage switchgear, hypersonic thermal protection systems and electromagnetic rail gun components, are prospected. The research results can provide reference for the material component design, advanced fabrication technology, microstructure and performance control of high-performance W–Cu composite materials in key fields and extreme service evaluation.
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spelling doaj-art-284b2a0e4104437b8f7802c44e2b7f592025-08-20T03:06:05ZengElsevierJournal of Materials Research and Technology2238-78542025-05-01363240326010.1016/j.jmrt.2025.04.040High-performance W–Cu composites preparation technology, modulation strategy and strengthening mechanismWeiyang Long0Yifan Yan1Mingzhu You2Haoran Wu3Zheng Wei4Hongfei Zhang5Shaodan Yang6Zhiyuan Zhu7Kexing Song8School of Materials Science and Engineering, Zhengzhou University, Zhengzhou, 450001, PR China; Institute of Materials, Henan Academy of Sciences, Zhengzhou, 450001, PR ChinaInstitute of Materials, Henan Academy of Sciences, Zhengzhou, 450001, PR China; Corresponding author.State Key Laboratory of High Performance & Advanced Welding Materials, China Academy of Machinery Zhengzhou Research Institute of Mechanical Engineering Co., Ltd., Zhengzhou 450001, PR ChinaInstitute of Materials, Henan Academy of Sciences, Zhengzhou, 450001, PR ChinaInstitute of Materials, Henan Academy of Sciences, Zhengzhou, 450001, PR ChinaInstitute of Materials, Henan Academy of Sciences, Zhengzhou, 450001, PR ChinaSchool of Materials Science and Engineering, Zhengzhou University, Zhengzhou, 450001, PR China; Institute of Materials, Henan Academy of Sciences, Zhengzhou, 450001, PR ChinaInstitute of Materials, Henan Academy of Sciences, Zhengzhou, 450001, PR ChinaInstitute of Materials, Henan Academy of Sciences, Zhengzhou, 450001, PR China; Corresponding author.W–Cu composites are widely used as electrode materials, electronic packaging materials, heat sinks, and targets in the defense industry, aerospace, and electronic information fields due to their good conductivity, high melting point, good mechanical properties, and good anti-arc erosion performance. In recent years, high-performance W alloys have gradually become the key materials in the defense industry and cutting-edge technologies, and new processing technologies have greatly improved the material density, uniformity of microstructure, mechanical properties, and physical properties of W alloys, but have also raised higher requirements for the high reliability, zero accidents, and long service life of defense and military materials. By optimizing the composite design and fabrication process, controlling the growth of microstructure and interfacial diffusion, and improving the fine grain distribution and uniformity, the densification, mechanical properties, and anti-arc erosion performance of W–Cu composites can be further improved. This paper reviews the evolution of preparation technology and modulation strategy for W–Cu composite, discusses the relationship between microstructure growth and mechanical properties of W–Cu composites, and systematically summarizes the influence mechanisms of alloy element content, existence form and microstructure on the electrical and thermal conductivity, strength, and erosion resistance of W–Cu composites. Finally, the future development trends and application prospects of W–Cu composites, including ultra-high voltage switchgear, hypersonic thermal protection systems and electromagnetic rail gun components, are prospected. The research results can provide reference for the material component design, advanced fabrication technology, microstructure and performance control of high-performance W–Cu composite materials in key fields and extreme service evaluation.http://www.sciencedirect.com/science/article/pii/S2238785425008610W–Cu compositesApplication fieldAdvanced preparation technologyMicrostructureStrengthening mechanism
spellingShingle Weiyang Long
Yifan Yan
Mingzhu You
Haoran Wu
Zheng Wei
Hongfei Zhang
Shaodan Yang
Zhiyuan Zhu
Kexing Song
High-performance W–Cu composites preparation technology, modulation strategy and strengthening mechanism
Journal of Materials Research and Technology
W–Cu composites
Application field
Advanced preparation technology
Microstructure
Strengthening mechanism
title High-performance W–Cu composites preparation technology, modulation strategy and strengthening mechanism
title_full High-performance W–Cu composites preparation technology, modulation strategy and strengthening mechanism
title_fullStr High-performance W–Cu composites preparation technology, modulation strategy and strengthening mechanism
title_full_unstemmed High-performance W–Cu composites preparation technology, modulation strategy and strengthening mechanism
title_short High-performance W–Cu composites preparation technology, modulation strategy and strengthening mechanism
title_sort high performance w cu composites preparation technology modulation strategy and strengthening mechanism
topic W–Cu composites
Application field
Advanced preparation technology
Microstructure
Strengthening mechanism
url http://www.sciencedirect.com/science/article/pii/S2238785425008610
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