Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic Devices

Advances in manufacturing technology are allowing for the realization of interaction circuit with microstructures. The capability to produce small circuit structures is allowing new opportunities for vacuum electronic devices producing terahertz (THz) frequency radiation, which is impractical with t...

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Main Authors: Xinghui Li, Jinjun Feng
Format: Article
Language:English
Published: MDPI AG 2024-11-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/15/11/1357
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author Xinghui Li
Jinjun Feng
author_facet Xinghui Li
Jinjun Feng
author_sort Xinghui Li
collection DOAJ
description Advances in manufacturing technology are allowing for the realization of interaction circuit with microstructures. The capability to produce small circuit structures is allowing new opportunities for vacuum electronic devices producing terahertz (THz) frequency radiation, which is impractical with traditional machining technology. This publication reviews recent progress on advanced microfabrication technologies applicable to interaction circuits of THz vacuum electronic devices, including LIGA/UV-LIGA (Ultraviolet Lithographic, Galvonoformung and Abformung), deep reactive ion etching (DRIE), micro/nano computer numerical control (CNC) milling, three-dimension (3D) printing, etc., and describes the current State-of-the-Art of their applications.
format Article
id doaj-art-2636dc97183c436d9adfc6d4ef8d0c2d
institution DOAJ
issn 2072-666X
language English
publishDate 2024-11-01
publisher MDPI AG
record_format Article
series Micromachines
spelling doaj-art-2636dc97183c436d9adfc6d4ef8d0c2d2025-08-20T02:48:01ZengMDPI AGMicromachines2072-666X2024-11-011511135710.3390/mi15111357Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic DevicesXinghui Li0Jinjun Feng1National Key Laboratory of Science and Technology on Vacuum Electronics, Beijing Vacuum Electronics Research Institute, Beijing 100015, ChinaNational Key Laboratory of Science and Technology on Vacuum Electronics, Beijing Vacuum Electronics Research Institute, Beijing 100015, ChinaAdvances in manufacturing technology are allowing for the realization of interaction circuit with microstructures. The capability to produce small circuit structures is allowing new opportunities for vacuum electronic devices producing terahertz (THz) frequency radiation, which is impractical with traditional machining technology. This publication reviews recent progress on advanced microfabrication technologies applicable to interaction circuits of THz vacuum electronic devices, including LIGA/UV-LIGA (Ultraviolet Lithographic, Galvonoformung and Abformung), deep reactive ion etching (DRIE), micro/nano computer numerical control (CNC) milling, three-dimension (3D) printing, etc., and describes the current State-of-the-Art of their applications.https://www.mdpi.com/2072-666X/15/11/1357THzvacuum electronics deviceinteraction circuitFWGmicrofabricationLIGA/UV-LIGA
spellingShingle Xinghui Li
Jinjun Feng
Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic Devices
Micromachines
THz
vacuum electronics device
interaction circuit
FWG
microfabrication
LIGA/UV-LIGA
title Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic Devices
title_full Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic Devices
title_fullStr Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic Devices
title_full_unstemmed Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic Devices
title_short Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic Devices
title_sort microfabrication technologies for interaction circuits of thz vacuum electronic devices
topic THz
vacuum electronics device
interaction circuit
FWG
microfabrication
LIGA/UV-LIGA
url https://www.mdpi.com/2072-666X/15/11/1357
work_keys_str_mv AT xinghuili microfabricationtechnologiesforinteractioncircuitsofthzvacuumelectronicdevices
AT jinjunfeng microfabricationtechnologiesforinteractioncircuitsofthzvacuumelectronicdevices