Linjie, L., Yi, F., Xiaoyang, M., & Liancheng, W. Investigation of thermal-mechanical performance of dual-chip SiC power devices based on Cu clip interconnection. Editorial Department of Electric Drive for Locomotives.
Chicago Style (17th ed.) CitationLinjie, LIAO, FAN Yi, MEI Xiaoyang, and WANG Liancheng. Investigation of Thermal-mechanical Performance of Dual-chip SiC Power Devices Based on Cu Clip Interconnection. Editorial Department of Electric Drive for Locomotives.
MLA (9th ed.) CitationLinjie, LIAO, et al. Investigation of Thermal-mechanical Performance of Dual-chip SiC Power Devices Based on Cu Clip Interconnection. Editorial Department of Electric Drive for Locomotives.
Warning: These citations may not always be 100% accurate.