Antenna-in-Package Using IC-Embedded Metal Fan-Out Wafer-Level Package for D-Band Applications
In this study, we present a low interconnection loss antenna-in-package (AiP) using a chip-embedded metal fan-out wafer-level package (mFOWLP) technology for D-band (110–170 GHz) applications. The package configuration enables interconnection with radio frequency monolithic microwave inte...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/11027070/ |
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