Investigating thermal effects on void formation in electromigration using thermoreflectance imaging
This study visualizes the time-variation of the generation, growth, and pattern of voids induced by the electromigration in Al micro-line type interconnections. The two-dimensional temperature distribution near the voids was measured simultaneously using thermoreflectance imaging (TRI) technique. Th...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
The Japan Society of Mechanical Engineers
2025-06-01
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| Series: | Journal of Thermal Science and Technology |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/jtst/20/1/20_25-00096/_pdf/-char/en |
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