Investigating thermal effects on void formation in electromigration using thermoreflectance imaging

Investigating thermal effects on void formation in electromigration using thermoreflectance imaging

This study visualizes the time-variation of the generation, growth, and pattern of voids induced by the electromigration in Al micro-line type interconnections. The two-dimensional temperature distribution near the voids was measured simultaneously using thermoreflectance imaging (TRI) technique. Th...

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Bibliographic Details
Main Authors: Kengo ARAKI, Kanji TAMAI, Reiko KURIYAMA, Kazuya TATSUMI
Format: Article
Language:English
Published: The Japan Society of Mechanical Engineers 2025-06-01
Series:Journal of Thermal Science and Technology
Subjects:
electromigration
void
temperature
heat transfer
thermoreflectance imaging
aluminum micro-line
line breakage
Online Access:https://www.jstage.jst.go.jp/article/jtst/20/1/20_25-00096/_pdf/-char/en
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