1 200 V Hybrid SiC Power Module with Low Stray Inductance

In order to realize low stray inductance package of 1 200 V hybrid Silicon Carbide (SiC) power module, the measures were taken including selecting optimum chips, optimizing chip layout and replacing bridge joint with low inductance busbar, so that the stray inductance decreased to 16 nH in the power...

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Bibliographic Details
Main Authors: LI Chengzhan, CHANG Guiqin, PENG Yongdian, FANG Jie, ZHOU Wangjun
Format: Article
Language:zho
Published: Editorial Office of Control and Information Technology 2016-01-01
Series:Kongzhi Yu Xinxi Jishu
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Online Access:http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2016.05.015
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