Board level BGA and CSP Underfill – diagnostic methods and the potential of using a tensile test and subsequent optical microscopy
Reducing the dimensions of Ball Grid Array (BGA) and Chip Scale Package (CSP) components in electronics design and manufacturing presents challenges similar to packages with flip-chips during temperature cycling. Therefore, underfill technology is increasingly used at the board level to enhance the...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-08-01
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| Series: | Polymer Testing |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0142941825001862 |
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