High Density Multi-Channel Passively Aligned Optical Probe for Testing of Photonic Integrated Circuits
In this work we report the results of high density multi-channel optical multiprobes with pitches of 25 <inline-formula><tex-math notation="LaTeX">${\mu }\rm{m}$</tex-math></inline-formula> and 50 <inline-formula><tex-math notation=&qu...
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IEEE
2021-01-01
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| Series: | IEEE Photonics Journal |
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| Online Access: | https://ieeexplore.ieee.org/document/9296295/ |
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| author | Xaveer Leijtens Rui Santos Kevin Williams |
| author_facet | Xaveer Leijtens Rui Santos Kevin Williams |
| author_sort | Xaveer Leijtens |
| collection | DOAJ |
| description | In this work we report the results of high density multi-channel optical multiprobes with pitches of 25 <inline-formula><tex-math notation="LaTeX">${\mu }\rm{m}$</tex-math></inline-formula> and 50 <inline-formula><tex-math notation="LaTeX">${\mu }\rm{m}$</tex-math></inline-formula> that provide edge-coupling used for on-wafer parallel testing of photonic integrated circuits. The probes are fabricated in an oxynitride platform and test demonstrations were carried out of edge-coupled indium-phosphide based photonic integrated circuits (PICs). Thirty-two optical parallel connections are simultaneously, passively aligned between the probe and the PIC by means of integrated guiding channels. The initial placement tolerance is more than 4 <inline-formula><tex-math notation="LaTeX">${\mu }\rm{m}$</tex-math></inline-formula> to give a passive alignment with an optical power variation of less than 1 dB. Multi-port loop-back optical power measurements are reported and the wavelength-dependent net modal gain of integrated semiconductor optical amplifiers was measured to further validate the concept. |
| format | Article |
| id | doaj-art-1df8147798e94dcb8ff687cdbe41f4fe |
| institution | OA Journals |
| issn | 1943-0655 |
| language | English |
| publishDate | 2021-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Photonics Journal |
| spelling | doaj-art-1df8147798e94dcb8ff687cdbe41f4fe2025-08-20T02:38:10ZengIEEEIEEE Photonics Journal1943-06552021-01-0113111510.1109/JPHOT.2020.30453469296295High Density Multi-Channel Passively Aligned Optical Probe for Testing of Photonic Integrated CircuitsXaveer Leijtens0https://orcid.org/0000-0001-7794-8236Rui Santos1Kevin Williams2Institute for Photonic Integration, Eindhoven University of Technology, Eindhoven, MB, NetherlandsPhotonIP BV, Eindhoven, BC, NetherlandsInstitute for Photonic Integration, Eindhoven University of Technology, Eindhoven, MB, NetherlandsIn this work we report the results of high density multi-channel optical multiprobes with pitches of 25 <inline-formula><tex-math notation="LaTeX">${\mu }\rm{m}$</tex-math></inline-formula> and 50 <inline-formula><tex-math notation="LaTeX">${\mu }\rm{m}$</tex-math></inline-formula> that provide edge-coupling used for on-wafer parallel testing of photonic integrated circuits. The probes are fabricated in an oxynitride platform and test demonstrations were carried out of edge-coupled indium-phosphide based photonic integrated circuits (PICs). Thirty-two optical parallel connections are simultaneously, passively aligned between the probe and the PIC by means of integrated guiding channels. The initial placement tolerance is more than 4 <inline-formula><tex-math notation="LaTeX">${\mu }\rm{m}$</tex-math></inline-formula> to give a passive alignment with an optical power variation of less than 1 dB. Multi-port loop-back optical power measurements are reported and the wavelength-dependent net modal gain of integrated semiconductor optical amplifiers was measured to further validate the concept.https://ieeexplore.ieee.org/document/9296295/Photonic integrated circuitsoptical probingfiber-chip coupling |
| spellingShingle | Xaveer Leijtens Rui Santos Kevin Williams High Density Multi-Channel Passively Aligned Optical Probe for Testing of Photonic Integrated Circuits IEEE Photonics Journal Photonic integrated circuits optical probing fiber-chip coupling |
| title | High Density Multi-Channel Passively Aligned Optical Probe for Testing of Photonic Integrated Circuits |
| title_full | High Density Multi-Channel Passively Aligned Optical Probe for Testing of Photonic Integrated Circuits |
| title_fullStr | High Density Multi-Channel Passively Aligned Optical Probe for Testing of Photonic Integrated Circuits |
| title_full_unstemmed | High Density Multi-Channel Passively Aligned Optical Probe for Testing of Photonic Integrated Circuits |
| title_short | High Density Multi-Channel Passively Aligned Optical Probe for Testing of Photonic Integrated Circuits |
| title_sort | high density multi channel passively aligned optical probe for testing of photonic integrated circuits |
| topic | Photonic integrated circuits optical probing fiber-chip coupling |
| url | https://ieeexplore.ieee.org/document/9296295/ |
| work_keys_str_mv | AT xaveerleijtens highdensitymultichannelpassivelyalignedopticalprobefortestingofphotonicintegratedcircuits AT ruisantos highdensitymultichannelpassivelyalignedopticalprobefortestingofphotonicintegratedcircuits AT kevinwilliams highdensitymultichannelpassivelyalignedopticalprobefortestingofphotonicintegratedcircuits |