Multilevel Operation in Scaled Back-End-of-Line Ferroelectric FETs With a Metal Interlayer

Multi-level operation, conventionally obtained in ferroelectric devices thanks to a domain-dependent inhomogeneous polarization, poses a big challenge for highly-scaled ferroelectric devices, where the number of ferroelectric domains is drastically reduced. In this work, we study a highly scaled bac...

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Main Authors: Chiara Rossi, Daniel Lizzit, David Esseni
Format: Article
Language:English
Published: IEEE 2025-01-01
Series:IEEE Access
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Online Access:https://ieeexplore.ieee.org/document/10966879/
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_version_ 1850155056128589824
author Chiara Rossi
Daniel Lizzit
David Esseni
author_facet Chiara Rossi
Daniel Lizzit
David Esseni
author_sort Chiara Rossi
collection DOAJ
description Multi-level operation, conventionally obtained in ferroelectric devices thanks to a domain-dependent inhomogeneous polarization, poses a big challenge for highly-scaled ferroelectric devices, where the number of ferroelectric domains is drastically reduced. In this work, we study a highly scaled back-end-of-line (BEOL) compatible, ferroelectric field-effect transistor (FeFET) that integrates a metal interlayer in the gate stack. Through analytical models and calibrated TCAD simulations, we show how this device can achieve a multi-level operation exploiting the interplay between the ferroelectric polarization and the charge in the metal interlayer. Such a working principle does not rely on a domain-dependent inhomogeneous polarization, and the device operation is thus ensured also for a homogeneous ferroelectric material. We also demonstrate that the charge in the interlayer can effectively stabilize the ferroelectric polarization even in the absence of a high concentration of trapped charges in the gate stack. The potentiation and depression curves for the readout conductance confirm that the proposed device can be operated as a memristor for neuromorphic computing applications. Moreover, we show how the choice of the dielectric in the metal-ferroelectric-dielectric-metal gate stack can be used as a design knob to reduce the device operation voltage.
format Article
id doaj-art-1ab81fdfd66a4b5486254da69a3b5e1d
institution OA Journals
issn 2169-3536
language English
publishDate 2025-01-01
publisher IEEE
record_format Article
series IEEE Access
spelling doaj-art-1ab81fdfd66a4b5486254da69a3b5e1d2025-08-20T02:25:04ZengIEEEIEEE Access2169-35362025-01-0113685256853510.1109/ACCESS.2025.356125510966879Multilevel Operation in Scaled Back-End-of-Line Ferroelectric FETs With a Metal InterlayerChiara Rossi0https://orcid.org/0000-0001-6976-7486Daniel Lizzit1https://orcid.org/0000-0002-5243-5888David Esseni2https://orcid.org/0000-0002-3468-5197DPIA, University of Udine, Udine, ItalyDPIA, University of Udine, Udine, ItalyDPIA, University of Udine, Udine, ItalyMulti-level operation, conventionally obtained in ferroelectric devices thanks to a domain-dependent inhomogeneous polarization, poses a big challenge for highly-scaled ferroelectric devices, where the number of ferroelectric domains is drastically reduced. In this work, we study a highly scaled back-end-of-line (BEOL) compatible, ferroelectric field-effect transistor (FeFET) that integrates a metal interlayer in the gate stack. Through analytical models and calibrated TCAD simulations, we show how this device can achieve a multi-level operation exploiting the interplay between the ferroelectric polarization and the charge in the metal interlayer. Such a working principle does not rely on a domain-dependent inhomogeneous polarization, and the device operation is thus ensured also for a homogeneous ferroelectric material. We also demonstrate that the charge in the interlayer can effectively stabilize the ferroelectric polarization even in the absence of a high concentration of trapped charges in the gate stack. The potentiation and depression curves for the readout conductance confirm that the proposed device can be operated as a memristor for neuromorphic computing applications. Moreover, we show how the choice of the dielectric in the metal-ferroelectric-dielectric-metal gate stack can be used as a design knob to reduce the device operation voltage.https://ieeexplore.ieee.org/document/10966879/BEOL integrationferroelectric field-effect transistor (FeFET)metal-ferroelectric–metal-insulator–semiconductor (MFMIS)TCAD simulation
spellingShingle Chiara Rossi
Daniel Lizzit
David Esseni
Multilevel Operation in Scaled Back-End-of-Line Ferroelectric FETs With a Metal Interlayer
IEEE Access
BEOL integration
ferroelectric field-effect transistor (FeFET)
metal-ferroelectric–metal-insulator–semiconductor (MFMIS)
TCAD simulation
title Multilevel Operation in Scaled Back-End-of-Line Ferroelectric FETs With a Metal Interlayer
title_full Multilevel Operation in Scaled Back-End-of-Line Ferroelectric FETs With a Metal Interlayer
title_fullStr Multilevel Operation in Scaled Back-End-of-Line Ferroelectric FETs With a Metal Interlayer
title_full_unstemmed Multilevel Operation in Scaled Back-End-of-Line Ferroelectric FETs With a Metal Interlayer
title_short Multilevel Operation in Scaled Back-End-of-Line Ferroelectric FETs With a Metal Interlayer
title_sort multilevel operation in scaled back end of line ferroelectric fets with a metal interlayer
topic BEOL integration
ferroelectric field-effect transistor (FeFET)
metal-ferroelectric–metal-insulator–semiconductor (MFMIS)
TCAD simulation
url https://ieeexplore.ieee.org/document/10966879/
work_keys_str_mv AT chiararossi multileveloperationinscaledbackendoflineferroelectricfetswithametalinterlayer
AT daniellizzit multileveloperationinscaledbackendoflineferroelectricfetswithametalinterlayer
AT davidesseni multileveloperationinscaledbackendoflineferroelectricfetswithametalinterlayer