Ultra-fast etching of photoresist by reactive atmospheric-pressure thermal plasma jet with surface temperature measurement
Atmospheric-pressure reactive thermal plasma jet (R-TPJ) with Ar and O _2 gas mixture was applied to the etching of photoresist (PR) on a silicon wafer. Optical interference contactless thermometry (OICT) and optical emission spectroscopy were carried out to clarify the relationship between the etch...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2025-01-01
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| Series: | Applied Physics Express |
| Subjects: | |
| Online Access: | https://doi.org/10.35848/1882-0786/ada374 |
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