Semiconductor Chipping Improvement via a Full Sandwich Wafer Mounting Technique
Silicon wafers have been widely used in semiconductor manufacturing, and chipping issues often highlighted during wafer dicing which affects device performance and reliability. The phenomenon of chipping has been observed to have detrimental effects on die strength, leading to the potential of crack...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
OICC Press
2024-04-01
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| Series: | Majlesi Journal of Electrical Engineering |
| Subjects: | |
| Online Access: | https://oiccpress.com/mjee/article/view/5048 |
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