Accelerate Aging Test Method for Press-Pack IGBT Power Module
Since reliability test of Press-pack IGBT (PPI) still not been researched enough, based on its application in industry, A cycle aging test methods aimed at VSC-HVDC power unit are proposed. The junction temperature formulas for all test methods are obtained by analyzing promising test waveforms and...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
State Grid Energy Research Institute
2022-10-01
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| Series: | Zhongguo dianli |
| Subjects: | |
| Online Access: | https://www.electricpower.com.cn/CN/10.11930/j.issn.1004-9649.202108087 |
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| Summary: | Since reliability test of Press-pack IGBT (PPI) still not been researched enough, based on its application in industry, A cycle aging test methods aimed at VSC-HVDC power unit are proposed. The junction temperature formulas for all test methods are obtained by analyzing promising test waveforms and thermal impedance models under the specific test conditions. Experiments results illustrate measured junction temperature waveforms of PPI that under the aging tests, and proposed methods are validated. |
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| ISSN: | 1004-9649 |