Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
1981-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/APEC.8.27 |
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