The structural regulation of H-bonding network in the chemically-bonded polyimide/silica nanocomposite with excellent mechanical stability and improved moisture resistance
Polymer-based nanocomposites, being widely concerned for lightweight and high-strength functional materials, still exhibit irreversible failures to resist mechanical damage and water erosion. In this paper, a kind of hydroxyl-rich silica nanomaterial was prepared and used for fabricating the chemica...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-02-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127525000322 |
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| Summary: | Polymer-based nanocomposites, being widely concerned for lightweight and high-strength functional materials, still exhibit irreversible failures to resist mechanical damage and water erosion. In this paper, a kind of hydroxyl-rich silica nanomaterial was prepared and used for fabricating the chemically-bonded polyimide (PI)/hydroxyl-rich silica (SiO2-OH) nanocomposite through the surface-initiated curing and the coupling reaction, which then regulate the H-bonding network within the PI matrix. As a result, the prepared nanocomposite performed excellent thermal stability (Tg reaches 442.5℃) and improved mechanical properties. The improved nano-construction incorporates the film with the rebuilt H-bonding network to improve the moisture resistance of the PI matrix. This work, focusing on the constitution of chemically-bonded silicon-containing nanocomposite structure, will promote an in-depth understanding of the relationship between structure and properties of polymer film materials, being beneficial for the development of modern polymer-based materials of long-term service life. |
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| ISSN: | 0264-1275 |