Study on the Stress and Warpage of Flip Chip Package Under Current Crowding
In order to study the influence of current accumulation on flip chip packaging a three-dimensional package model of flip chip is built and the electro-thermal and thermal-structure couplings are analyzed with finite element technique to obtain the temperature distribution stress distribution and dis...
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| Format: | Article |
| Language: | English |
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Editorial Department of Journal of Nantong University (Natural Science Edition)
2020-12-01
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| Series: | Nantong Daxue xuebao. Ziran kexue ban |
| Subjects: | |
| Online Access: | https://ngzke.cbpt.cnki.net/portal/journal/portal/client/paper/50ad9cf4d19ff041a558ad3e20bfc69b |
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| _version_ | 1849222372333191168 |
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| author | SHE Chenhui; YANG Longlong; TAN Lipeng; LIU Peisheng |
| author_facet | SHE Chenhui; YANG Longlong; TAN Lipeng; LIU Peisheng |
| author_sort | SHE Chenhui; YANG Longlong; TAN Lipeng; LIU Peisheng |
| collection | DOAJ |
| description | In order to study the influence of current accumulation on flip chip packaging a three-dimensional package model of flip chip is built and the electro-thermal and thermal-structure couplings are analyzed with finite element technique to obtain the temperature distribution stress distribution and displacement for the flip chip ball grid array(FCBGA) package. The results show that the highest temperature appears in the center of the epoxy resin for the package and the chip has the highest temperature at the solder bumps where the current is concentrated; the displacement of the package increases from the center to the edge. The maximum displacement is at the corner furthest from the center. The findings can be applied in the FCBGA package design. |
| format | Article |
| id | doaj-art-12734ad0e6bb4390acd897fc65ec1eaa |
| institution | Kabale University |
| issn | 1673-2340 |
| language | English |
| publishDate | 2020-12-01 |
| publisher | Editorial Department of Journal of Nantong University (Natural Science Edition) |
| record_format | Article |
| series | Nantong Daxue xuebao. Ziran kexue ban |
| spelling | doaj-art-12734ad0e6bb4390acd897fc65ec1eaa2025-08-26T06:04:05ZengEditorial Department of Journal of Nantong University (Natural Science Edition)Nantong Daxue xuebao. Ziran kexue ban1673-23402020-12-011904424810.12194/j.ntu.20200922002Study on the Stress and Warpage of Flip Chip Package Under Current CrowdingSHE Chenhui; YANG Longlong; TAN Lipeng; LIU Peisheng0School of Information Science and Technology, Nantong University;Nantong University Xinglin CollegeIn order to study the influence of current accumulation on flip chip packaging a three-dimensional package model of flip chip is built and the electro-thermal and thermal-structure couplings are analyzed with finite element technique to obtain the temperature distribution stress distribution and displacement for the flip chip ball grid array(FCBGA) package. The results show that the highest temperature appears in the center of the epoxy resin for the package and the chip has the highest temperature at the solder bumps where the current is concentrated; the displacement of the package increases from the center to the edge. The maximum displacement is at the corner furthest from the center. The findings can be applied in the FCBGA package design.https://ngzke.cbpt.cnki.net/portal/journal/portal/client/paper/50ad9cf4d19ff041a558ad3e20bfc69bflip chippackagingthermal-stresswarpagereliability |
| spellingShingle | SHE Chenhui; YANG Longlong; TAN Lipeng; LIU Peisheng Study on the Stress and Warpage of Flip Chip Package Under Current Crowding Nantong Daxue xuebao. Ziran kexue ban flip chip packaging thermal-stress warpage reliability |
| title | Study on the Stress and Warpage of Flip Chip Package Under Current Crowding |
| title_full | Study on the Stress and Warpage of Flip Chip Package Under Current Crowding |
| title_fullStr | Study on the Stress and Warpage of Flip Chip Package Under Current Crowding |
| title_full_unstemmed | Study on the Stress and Warpage of Flip Chip Package Under Current Crowding |
| title_short | Study on the Stress and Warpage of Flip Chip Package Under Current Crowding |
| title_sort | study on the stress and warpage of flip chip package under current crowding |
| topic | flip chip packaging thermal-stress warpage reliability |
| url | https://ngzke.cbpt.cnki.net/portal/journal/portal/client/paper/50ad9cf4d19ff041a558ad3e20bfc69b |
| work_keys_str_mv | AT shechenhuiyanglonglongtanlipengliupeisheng studyonthestressandwarpageofflipchippackageundercurrentcrowding |