Design of DC-60 GHz silicon based vertical interconnection structure
A vertical interconnection structure based on a stack of multi-layer silicon interposer boards is designed. The simulation results of the vertical interconnection structure of the two interlayer structure not considering and considering the SiO2 layer on the silicon surface were compared in the DC-6...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
National Computer System Engineering Research Institute of China
2022-01-01
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| Series: | Dianzi Jishu Yingyong |
| Subjects: | |
| Online Access: | http://www.chinaaet.com/article/3000145098 |
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