APA (7th ed.) Citation

Xu, W., Zhao, R., Yang, X., Guo, L., Xie, C., & Wu, D. Coupled Effect of Curing Temperature and Moisture on THM Behavior of Cemented Paste Backfill. Wiley.

Chicago Style (17th ed.) Citation

Xu, Wenyuan, Runkang Zhao, Xiaocong Yang, Lijie Guo, Chaowu Xie, and Di Wu. Coupled Effect of Curing Temperature and Moisture on THM Behavior of Cemented Paste Backfill. Wiley.

MLA (9th ed.) Citation

Xu, Wenyuan, et al. Coupled Effect of Curing Temperature and Moisture on THM Behavior of Cemented Paste Backfill. Wiley.