Boosting non-oxide interfacial Co/SiO2 hybrid bonding by selective surface activation
Due to its superior nanoscale properties, cobalt (Co) is highly desirable for ultrahigh-density 3D integration into materials through metal/dielectric hybrid bonding. However, this process is very challenging through Co/SiO _2 hybrid bonding, as very hydrophilic SiO _2 surfaces are needed for bondin...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2025-01-01
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| Series: | International Journal of Extreme Manufacturing |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2631-7990/ada834 |
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