High-Performance EMI Shielding Film Based on Low-D<sub>k</sub> Polyimide and Trimodal Ag Ink for High-Speed Signal Integrity Enhancement

High-Performance EMI Shielding Film Based on Low-D<sub>k</sub> Polyimide and Trimodal Ag Ink for High-Speed Signal Integrity Enhancement

Electromagnetic interference (EMI) shielding is critical for maintaining signal integrity in high-speed electronic packaging. However, conventional shielding approaches face limitations in process complexity and spatial efficiency. In this study, an EMI shielding film based on trimodal silver (Ag) i...

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Bibliographic Details
Main Authors: Moses Gu, Suin Chae, Seonwoo Kim, Yubin Kim, Shinui Kang, Soobin Park, Se-Hoon Park, Sung-Hoon Choa, Hyunjin Nam
Format: Article
Language:English
Published: MDPI AG 2025-05-01
Series:Micro
Subjects:
EMI shielding film
low-k PI
high-speed signal integrity
crosstalk suppression
Online Access:https://www.mdpi.com/2673-8023/5/2/26
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