Development of High Temperature Oxidation Technology for SiC and Analysis on the Characteristics of its Interface

It used n-type 4° off-axis 4H-SiC (0001) substrates to form SiO2 layers by thermal oxidation in the condition of 1 200 ℃, 1 250 ℃, 1 300 ℃as well as 1 350 ℃, and analyzed the SiO2/SiC interface via the C-V and I-V characteristics of MOS capacitor structure. The results show that the interface state...

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Main Authors: ZHAO Yanli, LI Chengzhan, JIANG Huaping, XUN Hengyu
Format: Article
Language:zho
Published: Editorial Office of Control and Information Technology 2015-01-01
Series:Kongzhi Yu Xinxi Jishu
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Online Access:http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2015.01.008
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author ZHAO Yanli
LI Chengzhan
JIANG Huaping
XUN Hengyu
author_facet ZHAO Yanli
LI Chengzhan
JIANG Huaping
XUN Hengyu
author_sort ZHAO Yanli
collection DOAJ
description It used n-type 4° off-axis 4H-SiC (0001) substrates to form SiO2 layers by thermal oxidation in the condition of 1 200 ℃, 1 250 ℃, 1 300 ℃as well as 1 350 ℃, and analyzed the SiO2/SiC interface via the C-V and I-V characteristics of MOS capacitor structure. The results show that the interface state density close to the conduction band edge is reduced as the SiO2 layer oxidized at 1 350 ℃, which is useful for SiO2 layers grown at 1 350 ℃. In addition, the breakdown electrical field is tested above 6 MV/cm, which can meet SiC MOSFET working requirements while temperature is below 1 300 ℃.
format Article
id doaj-art-0b2a296b46924613a5eb5ccd0d0d0237
institution Kabale University
issn 2096-5427
language zho
publishDate 2015-01-01
publisher Editorial Office of Control and Information Technology
record_format Article
series Kongzhi Yu Xinxi Jishu
spelling doaj-art-0b2a296b46924613a5eb5ccd0d0d02372025-08-25T06:54:27ZzhoEditorial Office of Control and Information TechnologyKongzhi Yu Xinxi Jishu2096-54272015-01-01363882327990Development of High Temperature Oxidation Technology for SiC and Analysis on the Characteristics of its InterfaceZHAO YanliLI ChengzhanJIANG HuapingXUN HengyuIt used n-type 4° off-axis 4H-SiC (0001) substrates to form SiO2 layers by thermal oxidation in the condition of 1 200 ℃, 1 250 ℃, 1 300 ℃as well as 1 350 ℃, and analyzed the SiO2/SiC interface via the C-V and I-V characteristics of MOS capacitor structure. The results show that the interface state density close to the conduction band edge is reduced as the SiO2 layer oxidized at 1 350 ℃, which is useful for SiO2 layers grown at 1 350 ℃. In addition, the breakdown electrical field is tested above 6 MV/cm, which can meet SiC MOSFET working requirements while temperature is below 1 300 ℃.http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2015.01.008SiC oxidation processinterface state densitybreakdown electrical fieldC-V characteristicI-V characteristic
spellingShingle ZHAO Yanli
LI Chengzhan
JIANG Huaping
XUN Hengyu
Development of High Temperature Oxidation Technology for SiC and Analysis on the Characteristics of its Interface
Kongzhi Yu Xinxi Jishu
SiC oxidation process
interface state density
breakdown electrical field
C-V characteristic
I-V characteristic
title Development of High Temperature Oxidation Technology for SiC and Analysis on the Characteristics of its Interface
title_full Development of High Temperature Oxidation Technology for SiC and Analysis on the Characteristics of its Interface
title_fullStr Development of High Temperature Oxidation Technology for SiC and Analysis on the Characteristics of its Interface
title_full_unstemmed Development of High Temperature Oxidation Technology for SiC and Analysis on the Characteristics of its Interface
title_short Development of High Temperature Oxidation Technology for SiC and Analysis on the Characteristics of its Interface
title_sort development of high temperature oxidation technology for sic and analysis on the characteristics of its interface
topic SiC oxidation process
interface state density
breakdown electrical field
C-V characteristic
I-V characteristic
url http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2015.01.008
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AT lichengzhan developmentofhightemperatureoxidationtechnologyforsicandanalysisonthecharacteristicsofitsinterface
AT jianghuaping developmentofhightemperatureoxidationtechnologyforsicandanalysisonthecharacteristicsofitsinterface
AT xunhengyu developmentofhightemperatureoxidationtechnologyforsicandanalysisonthecharacteristicsofitsinterface