Park, H., Cha, B., & Rhee, B. Experimental and Numerical Investigation of the Effect of Process Conditions on Residual Wall Thickness and Cooling and Surface Characteristics of Water-Assisted Injection Molded Hollow Products. Wiley.
Chicago Style (17th ed.) CitationPark, Hyungpil, Baeg-Soon Cha, and Byungohk Rhee. Experimental and Numerical Investigation of the Effect of Process Conditions on Residual Wall Thickness and Cooling and Surface Characteristics of Water-Assisted Injection Molded Hollow Products. Wiley.
MLA (9th ed.) CitationPark, Hyungpil, et al. Experimental and Numerical Investigation of the Effect of Process Conditions on Residual Wall Thickness and Cooling and Surface Characteristics of Water-Assisted Injection Molded Hollow Products. Wiley.
Warning: These citations may not always be 100% accurate.