Thermal Analysis of System in Package Considering Boundary Conditions for Long-Term Reliability Studies
This paper proposes an integrated Foster-based thermal network for a System in Package (SiP) that models thermal interaction between package layers to predict the transient temperature of junctions and interlayer compression in SiP. The critical factors contributing to impedance mismatch are detaile...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10517584/ |
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