Thermal Analysis of System in Package Considering Boundary Conditions for Long-Term Reliability Studies
This paper proposes an integrated Foster-based thermal network for a System in Package (SiP) that models thermal interaction between package layers to predict the transient temperature of junctions and interlayer compression in SiP. The critical factors contributing to impedance mismatch are detaile...
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| Format: | Article |
| Language: | English |
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IEEE
2025-01-01
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| Series: | IEEE Access |
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| Online Access: | https://ieeexplore.ieee.org/document/10517584/ |
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| author | Djallel Eddine Touati Aziz Oukaira Ahmad Hassan Mohamed Ali Yvon Savaria Ahmed Lakhssassi |
| author_facet | Djallel Eddine Touati Aziz Oukaira Ahmad Hassan Mohamed Ali Yvon Savaria Ahmed Lakhssassi |
| author_sort | Djallel Eddine Touati |
| collection | DOAJ |
| description | This paper proposes an integrated Foster-based thermal network for a System in Package (SiP) that models thermal interaction between package layers to predict the transient temperature of junctions and interlayer compression in SiP. The critical factors contributing to impedance mismatch are detailed to ensure modeling accuracy. Important factors include the boundary conditions and the interface layer of the thermal material. With the help of the Finite Element Method (FEM) and data curve fitting, thermal parameters are derived and expressed as a function of boundary conditions. The proposed modeling method is demonstrated with 3D heterogeneous System in Package models implemented in Simulink for long-term temperature predictions. Predicted junction and interlayer temperatures show good accuracy, confirmed by reported results obtained by Finite Element Analysis (FEA). The importance of considering the boundary conditions and the materials used in the various interfaces is shown through simulation results. Neglecting one of these key factors, the predicted temperature differs by as much as 14.5 °C in the reported results. The proposed thermal network is consistent with FEA, while computing much faster and producing results that differ by no more than 0.5 °C, unlike previously reported models. |
| format | Article |
| id | doaj-art-09a1e46e14424907b6ed91c934b4ec2e |
| institution | Kabale University |
| issn | 2169-3536 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Access |
| spelling | doaj-art-09a1e46e14424907b6ed91c934b4ec2e2025-08-20T03:56:03ZengIEEEIEEE Access2169-35362025-01-011312775812776910.1109/ACCESS.2024.339637310517584Thermal Analysis of System in Package Considering Boundary Conditions for Long-Term Reliability StudiesDjallel Eddine Touati0https://orcid.org/0000-0002-1604-6674Aziz Oukaira1Ahmad Hassan2https://orcid.org/0000-0002-2215-5375Mohamed Ali3https://orcid.org/0000-0002-7476-7920Yvon Savaria4https://orcid.org/0000-0002-3404-9959Ahmed Lakhssassi5https://orcid.org/0000-0003-1781-3211Department of Engineering and Computer Science, Université du Québec en Outaouais, Gatineau, QC, CanadaElectrical Engineering Department, Polytechnique Montréal, Montreal, QC, CanadaElectrical Engineering Department, Polytechnique Montréal, Montreal, QC, CanadaElectrical Engineering Department, Polytechnique Montréal, Montreal, QC, CanadaElectrical Engineering Department, Polytechnique Montréal, Montreal, QC, CanadaDepartment of Engineering and Computer Science, Université du Québec en Outaouais, Gatineau, QC, CanadaThis paper proposes an integrated Foster-based thermal network for a System in Package (SiP) that models thermal interaction between package layers to predict the transient temperature of junctions and interlayer compression in SiP. The critical factors contributing to impedance mismatch are detailed to ensure modeling accuracy. Important factors include the boundary conditions and the interface layer of the thermal material. With the help of the Finite Element Method (FEM) and data curve fitting, thermal parameters are derived and expressed as a function of boundary conditions. The proposed modeling method is demonstrated with 3D heterogeneous System in Package models implemented in Simulink for long-term temperature predictions. Predicted junction and interlayer temperatures show good accuracy, confirmed by reported results obtained by Finite Element Analysis (FEA). The importance of considering the boundary conditions and the materials used in the various interfaces is shown through simulation results. Neglecting one of these key factors, the predicted temperature differs by as much as 14.5 °C in the reported results. The proposed thermal network is consistent with FEA, while computing much faster and producing results that differ by no more than 0.5 °C, unlike previously reported models.https://ieeexplore.ieee.org/document/10517584/Finite element analysis (FEA)finite element method (FEM)heat transfer and interactionintegrated circuits (ICs)system-in-package (SiP)thermal model |
| spellingShingle | Djallel Eddine Touati Aziz Oukaira Ahmad Hassan Mohamed Ali Yvon Savaria Ahmed Lakhssassi Thermal Analysis of System in Package Considering Boundary Conditions for Long-Term Reliability Studies IEEE Access Finite element analysis (FEA) finite element method (FEM) heat transfer and interaction integrated circuits (ICs) system-in-package (SiP) thermal model |
| title | Thermal Analysis of System in Package Considering Boundary Conditions for Long-Term Reliability Studies |
| title_full | Thermal Analysis of System in Package Considering Boundary Conditions for Long-Term Reliability Studies |
| title_fullStr | Thermal Analysis of System in Package Considering Boundary Conditions for Long-Term Reliability Studies |
| title_full_unstemmed | Thermal Analysis of System in Package Considering Boundary Conditions for Long-Term Reliability Studies |
| title_short | Thermal Analysis of System in Package Considering Boundary Conditions for Long-Term Reliability Studies |
| title_sort | thermal analysis of system in package considering boundary conditions for long term reliability studies |
| topic | Finite element analysis (FEA) finite element method (FEM) heat transfer and interaction integrated circuits (ICs) system-in-package (SiP) thermal model |
| url | https://ieeexplore.ieee.org/document/10517584/ |
| work_keys_str_mv | AT djalleleddinetouati thermalanalysisofsysteminpackageconsideringboundaryconditionsforlongtermreliabilitystudies AT azizoukaira thermalanalysisofsysteminpackageconsideringboundaryconditionsforlongtermreliabilitystudies AT ahmadhassan thermalanalysisofsysteminpackageconsideringboundaryconditionsforlongtermreliabilitystudies AT mohamedali thermalanalysisofsysteminpackageconsideringboundaryconditionsforlongtermreliabilitystudies AT yvonsavaria thermalanalysisofsysteminpackageconsideringboundaryconditionsforlongtermreliabilitystudies AT ahmedlakhssassi thermalanalysisofsysteminpackageconsideringboundaryconditionsforlongtermreliabilitystudies |