Jianhua, Z., Jianzhong, J., & Xueming, H. Influence of the Molecular Adhesion Force on the Indentation Depth of a Particle into the Wafer Surface in the CMP Process. Wiley.
Chicago Style (17th ed.) CitationJianhua, Zhou, Jiang Jianzhong, and He Xueming. Influence of the Molecular Adhesion Force on the Indentation Depth of a Particle into the Wafer Surface in the CMP Process. Wiley.
MLA (9th ed.) CitationJianhua, Zhou, et al. Influence of the Molecular Adhesion Force on the Indentation Depth of a Particle into the Wafer Surface in the CMP Process. Wiley.
Warning: These citations may not always be 100% accurate.