Development of Flux for Lead free Soldering of High Power Devices
Halogen-free low-Rosin flux was applied to lead-free soldering of the high-power devices with orthogonal test method. The compositions of flux such as active agent, solvents, film-forming agent were optimized and the spreading rate, corrosion resistance and physical properties of the flux were texte...
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| Format: | Article |
| Language: | zho |
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Harbin University of Science and Technology Publications
2018-06-01
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| Series: | Journal of Harbin University of Science and Technology |
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| Online Access: | https://hlgxb.hrbust.edu.cn/#/digest?ArticleID=1532 |
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| _version_ | 1849228485650808832 |
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| author | SUN Feng-lian PENG Li-juan |
| author_facet | SUN Feng-lian PENG Li-juan |
| author_sort | SUN Feng-lian |
| collection | DOAJ |
| description | Halogen-free low-Rosin flux was applied to lead-free soldering of the high-power devices with orthogonal test method. The compositions of flux such as active agent, solvents, film-forming agent were optimized and the spreading rate, corrosion resistance and physical properties of the flux were texted, according to GB/T 31474-2015 soldering fluxes for high-quality interconnections in electronic assembly. The results showed that: the new flux has good physical stability and wettability, and the highest average rate of expansion is 86%, when mass fraction of organic acid active agent is 15%, rosin mass fraction is 30% and thixotropic agent is 1% in the flux. The corrosion of residues after reflow is little to the copper plate, and the new flux well meets the requirements of the electronic device. |
| format | Article |
| id | doaj-art-05d902fdb25c4f5b8e3b0e830441d0f3 |
| institution | Kabale University |
| issn | 1007-2683 |
| language | zho |
| publishDate | 2018-06-01 |
| publisher | Harbin University of Science and Technology Publications |
| record_format | Article |
| series | Journal of Harbin University of Science and Technology |
| spelling | doaj-art-05d902fdb25c4f5b8e3b0e830441d0f32025-08-23T01:23:25ZzhoHarbin University of Science and Technology PublicationsJournal of Harbin University of Science and Technology1007-26832018-06-012303565910.15938/j.jhust.2018.03.010Development of Flux for Lead free Soldering of High Power DevicesSUN Feng-lian0PENG Li-juan1School of Material Science and Engineering，Harbin University of Science and Technology，Harbin 150040，ChinaSchool of Material Science and Engineering，Harbin University of Science and Technology，Harbin 150040，ChinaHalogen-free low-Rosin flux was applied to lead-free soldering of the high-power devices with orthogonal test method. The compositions of flux such as active agent, solvents, film-forming agent were optimized and the spreading rate, corrosion resistance and physical properties of the flux were texted, according to GB/T 31474-2015 soldering fluxes for high-quality interconnections in electronic assembly. The results showed that: the new flux has good physical stability and wettability, and the highest average rate of expansion is 86%, when mass fraction of organic acid active agent is 15%, rosin mass fraction is 30% and thixotropic agent is 1% in the flux. The corrosion of residues after reflow is little to the copper plate, and the new flux well meets the requirements of the electronic device.https://hlgxb.hrbust.edu.cn/#/digest?ArticleID=1532fluxactive agentspreading rate |
| spellingShingle | SUN Feng-lian PENG Li-juan Development of Flux for Lead free Soldering of High Power Devices Journal of Harbin University of Science and Technology flux active agent spreading rate |
| title | Development of Flux for Lead free Soldering of High Power Devices |
| title_full | Development of Flux for Lead free Soldering of High Power Devices |
| title_fullStr | Development of Flux for Lead free Soldering of High Power Devices |
| title_full_unstemmed | Development of Flux for Lead free Soldering of High Power Devices |
| title_short | Development of Flux for Lead free Soldering of High Power Devices |
| title_sort | development of flux for lead free soldering of high power devices |
| topic | flux active agent spreading rate |
| url | https://hlgxb.hrbust.edu.cn/#/digest?ArticleID=1532 |
| work_keys_str_mv | AT sunfenglian developmentoffluxforleadfreesolderingofhighpowerdevices AT penglijuan developmentoffluxforleadfreesolderingofhighpowerdevices |