Development of Flux for Lead free Soldering of High Power Devices
Halogen-free low-Rosin flux was applied to lead-free soldering of the high-power devices with orthogonal test method. The compositions of flux such as active agent, solvents, film-forming agent were optimized and the spreading rate, corrosion resistance and physical properties of the flux were texte...
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| Main Authors: | , |
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| Format: | Article |
| Language: | zho |
| Published: |
Harbin University of Science and Technology Publications
2018-06-01
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| Series: | Journal of Harbin University of Science and Technology |
| Subjects: | |
| Online Access: | https://hlgxb.hrbust.edu.cn/#/digest?ArticleID=1532 |
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| Summary: | Halogen-free low-Rosin flux was applied to lead-free soldering of the high-power devices with orthogonal test method. The compositions of flux such as active agent, solvents, film-forming agent were optimized and the spreading rate, corrosion resistance and physical properties of the flux were texted, according to GB/T 31474-2015 soldering fluxes for high-quality interconnections in electronic assembly. The results showed that: the new flux has good physical stability and wettability, and the highest average rate of expansion is 86%, when mass fraction of organic acid active agent is 15%, rosin mass fraction is 30% and thixotropic agent is 1% in the flux. The corrosion of residues after reflow is little to the copper plate, and the new flux well meets the requirements of the electronic device. |
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| ISSN: | 1007-2683 |