Image processing for microprocessors TIM voids detection
Thermal interface material (TIM) is a substance designed to enhance thermal conductivity between two surfaces requiring efficient heat transfer. It is commonly applied between a microprocessor's silicon die and a heat sink or other cooling components, such as heat spreaders, to minimize t...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | deu |
| Published: |
NDT.net
2025-03-01
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| Series: | e-Journal of Nondestructive Testing |
| Online Access: | https://www.ndt.net/search/docs.php3?id=30849 |
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| Summary: | Thermal interface material (TIM) is a substance designed
to enhance thermal conductivity between two surfaces
requiring efficient heat transfer. It is commonly applied
between a microprocessor's silicon die and a heat sink or
other cooling components, such as heat spreaders, to
minimize thermal resistance caused by air gaps and surface
irregularities. This ensures optimal operating
temperatures, thereby improving the performance and
longevity of the microprocessor.However, voids can
form within the TIM layer during application to contact
surfaces, significantly impairing thermal dissipation. To
address this issue, non-destructive testing (NDT) imaging
techniques are often employed to inspect and detect TIM
voids. Common methods include Scanning Acoustic Microscopy
(SAM) and X-ray Laminography, which provide detailed
visualization of void distribution and structural
defects.To automatically quantify void occupation
within each rectangular shape die ROI (Region Of Interest),
a traditional image processing-based void detection
software has been developed. This software can
automatically identify the rectangular chip die area and
detect TIM voids within it. It then calculates the void
occupancy percentage for each die area.The Niblack
algorithm is employed in our void detection software.
Histogram curve analysis is applied to automatically
determine the threshold for the Niblack algorithm's test
value, with manual adjustments available for fine-tuning.
This approach allows for the recovery of small or weak
voids that may have been initially
missed. It also enhances or suppresses minor void
information, leading to more balanced and consistent void
detection outcomes.Currently, the software is
utilized for quality assurance and failure analysis. It is
the first commercially available software specifically for
automatic TIM void analysis.
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| ISSN: | 1435-4934 |