Understanding the Nanoindentation Edge Effect of Single-Crystal Silicon Using Molecular Dynamics Simulations
The edge effect refers to what occurs when an object undergoes elastic contact with the edge of a material. This is common in practical applications, but the understanding of this phenomenon is not yet mature enough, and understanding the microscopic characteristics of the material regarding this ph...
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| Format: | Article |
| Language: | English |
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MDPI AG
2025-07-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/16/7/814 |
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| author | Chao Long Ruihan Li Pengyue Zhao Ziteng Li Shuhao Kang Duo Li Huan Liu |
| author_facet | Chao Long Ruihan Li Pengyue Zhao Ziteng Li Shuhao Kang Duo Li Huan Liu |
| author_sort | Chao Long |
| collection | DOAJ |
| description | The edge effect refers to what occurs when an object undergoes elastic contact with the edge of a material. This is common in practical applications, but the understanding of this phenomenon is not yet mature enough, and understanding the microscopic characteristics of the material regarding this phenomenon is necessary. This article investigates the edge effects of single-crystal silicon at different indentation positions through molecular dynamics simulations. The results indicate that the edge effect of the indentation is influenced by the indentation position and depth. The closer the indentation head is to the edge of the workpiece, the more particles are extruded from the side of the workpiece and the wider the collapse range of the indentation surface. At the same time, the indentation position also affects the distribution of the von Mises stress and phase transition area. When the edge effect occurs, the von Mises stress and phase transition region tend to be concentrated near the workpiece edge. This study demonstrates the atomic-scale deformation mechanism of single-crystal silicon under varying indentation positions. |
| format | Article |
| id | doaj-art-04f4e5618bf14b40804d75ebba02ffc9 |
| institution | Kabale University |
| issn | 2072-666X |
| language | English |
| publishDate | 2025-07-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj-art-04f4e5618bf14b40804d75ebba02ffc92025-08-20T03:58:27ZengMDPI AGMicromachines2072-666X2025-07-0116781410.3390/mi16070814Understanding the Nanoindentation Edge Effect of Single-Crystal Silicon Using Molecular Dynamics SimulationsChao Long0Ruihan Li1Pengyue Zhao2Ziteng Li3Shuhao Kang4Duo Li5Huan Liu6Center of Ultra-Precision Optoelectronic Instrumentation Engineering, Harbin Institute of Technology, Harbin 150001, ChinaCollege of Mechanical and Electrical Engineering, Harbin Engineering University, Harbin 150001, ChinaCenter of Ultra-Precision Optoelectronic Instrumentation Engineering, Harbin Institute of Technology, Harbin 150001, ChinaState Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, ChinaState Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, ChinaState Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, ChinaCenter of Ultra-Precision Optoelectronic Instrumentation Engineering, Harbin Institute of Technology, Harbin 150001, ChinaThe edge effect refers to what occurs when an object undergoes elastic contact with the edge of a material. This is common in practical applications, but the understanding of this phenomenon is not yet mature enough, and understanding the microscopic characteristics of the material regarding this phenomenon is necessary. This article investigates the edge effects of single-crystal silicon at different indentation positions through molecular dynamics simulations. The results indicate that the edge effect of the indentation is influenced by the indentation position and depth. The closer the indentation head is to the edge of the workpiece, the more particles are extruded from the side of the workpiece and the wider the collapse range of the indentation surface. At the same time, the indentation position also affects the distribution of the von Mises stress and phase transition area. When the edge effect occurs, the von Mises stress and phase transition region tend to be concentrated near the workpiece edge. This study demonstrates the atomic-scale deformation mechanism of single-crystal silicon under varying indentation positions.https://www.mdpi.com/2072-666X/16/7/814molecular dynamicssingle-crystal Sinanoindentationedge effect |
| spellingShingle | Chao Long Ruihan Li Pengyue Zhao Ziteng Li Shuhao Kang Duo Li Huan Liu Understanding the Nanoindentation Edge Effect of Single-Crystal Silicon Using Molecular Dynamics Simulations Micromachines molecular dynamics single-crystal Si nanoindentation edge effect |
| title | Understanding the Nanoindentation Edge Effect of Single-Crystal Silicon Using Molecular Dynamics Simulations |
| title_full | Understanding the Nanoindentation Edge Effect of Single-Crystal Silicon Using Molecular Dynamics Simulations |
| title_fullStr | Understanding the Nanoindentation Edge Effect of Single-Crystal Silicon Using Molecular Dynamics Simulations |
| title_full_unstemmed | Understanding the Nanoindentation Edge Effect of Single-Crystal Silicon Using Molecular Dynamics Simulations |
| title_short | Understanding the Nanoindentation Edge Effect of Single-Crystal Silicon Using Molecular Dynamics Simulations |
| title_sort | understanding the nanoindentation edge effect of single crystal silicon using molecular dynamics simulations |
| topic | molecular dynamics single-crystal Si nanoindentation edge effect |
| url | https://www.mdpi.com/2072-666X/16/7/814 |
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